To becoming familiar with the our milling machine, we were interested in testing the the limits of the milling device. Below is an example of testing how small of a internal and external structure it can mill. The below figure suggest the device can mill internal structures of ~0.015 and external structures of >0.001. This process can allow us to know the limits of milling and for better design of future circuits when using this device.

When attempting to mill the circuit board, I realized the the board was not leveled. This was clear since the milling device was only able to mill part of the design and demonstrated a gradient of milling depth, as can be seen by the example below. To solve this problem, I instructed the device to mill at a higher part of the board. This lead to a successful milling process.

Below is the final product. Although I have had prior experience with soldering, this was still was challenging due to some of the small closely positioned pins, especially on the micro-controller chip. Some solder joints do not look ideal, but the device does work when plugged in. Since it is currently functional, I will re-make if there are any signs of failure in the future.