PCB Fabrication, Board Stuffing

substrates
   single-sided (1/0), double-sided (1/1), multi-layer
   rigid: FR1/2, FR4
   flex: Kapton (polyimide), epoxy film
   RF: Teflon, glass

formats
   Gerber, RS274X
   Excellon

processes
   mask: photoresist, thermal transfer
   etching: ferric chloride,  cupric chloride, ammonium persulfate, sodium persulfate
   board houses: Advanced, AP, Sierra
   machining
   cutting

packages
   through-hole, surface mount (SMT, SMD)
   2512-01005, SOD-, SOT-, SOIC, TSOP, TQFP
   BGA, MLF, CSP

assembly
   pick-and-place
   (re)work

solder
   composition
      eutectic alloy
      flux
      wetting
   paste
      dispense
      screen-print
      reflow
   liquid
      wave
      iron
   desolder
      vacuum
      braid
      hot air gun

ventilation

cleaning
   
ROHS

assignment
   cad hello.serial.45.cad
   gavrasm hello.serial.45.asm
   python rx.py /dev/ttyS0 9600
   avrdude -p t45 -c bsd -U flash:w:hello.serial.45.hex