Milling the board took longer than anticipated this week, as the quality of the milling was poor and I kept having to try new settings. Eventually I tried a new endmill, which was better, but only comparatively. I tried milling again a few days later and was able to get a decent board milled. Still not sure what was causing such rough milling.
Stuffing the board was straight forward this time around, with one small exception of a mysterious componant in the hello.array.44.2 design which was only refered to as "IC 5V". Eventually I figured it was a regulator due to it's footprint, voltage, and placement.
Once I had that figured out stuffing went smoothly.
Then it was time to place my vinyl vias shield. I had waited to place this after soldering to avoid burning the vinyl, as it melts at a temperature MUCH lower than solder. However, I was forgetting that I had designed the shield to lay under the componants - which probably didn't have the clearance anyway. It was just an idea for making the boards look more sleek I wanted to test out, which was now flubbed. Next time! Maybe post-vaccuum forming velumn over boards?
For a simple fix, I decided just to cut off the left half of the shield, leaving the essential vias which were still usable.
FAIL: It was a this point I accidently folded the vivyl in on itself, rendering it useless. It was after 11pm, so I would have to wait for until the next day for a recut.