Topics

 

Semiconductor Device Modelling

 

Theory

 

 

 

 

This work limits to pn-junction/mosfet and all material properties is assumed.

 

pn-Junction

 

 

 

Analytical vs Numerical


 

Boundary Condition

 

Vmax = 1.0; % max voltage for voltage sweep
Vmin = 0.0;

 

 

Drift-Diffusion Model

 

 

Non-linear Poisson's Equation

 

- Neglecting Magnetci Filed

 

 

Continuity Equations

 

 

Current Density Equations

 

 

 

Solving Poisson's Equation

 

- Finite Difference

- Finite Element (used in this work)

 

Galerkin Method: 1D Poisson's Equation [3]

 

 

Numerical Integration: Gaussian Quadrature

 

 

Gummel's Iteration Method

 

Gummel's method [2] solves the coupled set of semiconductor equations together with the
Poisson equation via a decoupled procedure. If we choose the quasi-Fermi level formulation, we
solve first a nonlinear Poisson's equation. The potential obtained from this solution is substituted
into the continuity equations, which are now linear, and are solved directly to conclude the
iteration step. The result in terms of quasi-Fermi levels is then substituted back into Poisson's
equation and the process repeated until convergence is reached. In order to check for
convergence, one can calculate the residuals obtained by positioning all the terms to the left hand
side of the equations and substituting the variables with the iteration values. For the exact
solution the residuals should be zero. Convergence is assumed when the residuals are smaller
than a set tolerance.

 

 

 

Simulation Parameters


ni = 1.45e10; % intrinsic concentration (cm^-3)
Na = 5e17; % concentration of acceptor atoms (cm^-3)
Nd = 1e17;
mu_n = 1400; % electron mobility
mu_p = 450; % hole mobility (cm^2 V^-1 s^-1)
D_n = ft * mu_n; % electron diffussion coefficient
D_p = ft * mu_p; % hole diffussion coefficient

 

 

Results of Simulation

 

Voltage Sweep and Potential Profile

 

 

 

 

Current-Voltage Characteristics

 

 

stepsize = 0.01

 

 

Electron/Holes Concentration

 

 

Fermi Potential

 

 

 

 

MOSFET

 

Device Structure

 

 

 

Current Concentration

 

 

 

 

 

Limitation

- Steady state analysis (no-transient)

-

 

 

 

 

Electrical Charactrizatino

 

Modules

 

Conductors - material propery (carrier concentraion, band-gap, fermi-level

 

 

Self-consistent ensemble Monte Carlo

 

Commertially available software Sentaurus Device [1]

 

[1] http://www.synopsys.com/Tools/TCAD/DeviceSimulation/Pages/default.aspx

[2] http://nanohub.org/resources/1565/download/ddmodel_solution_details_word.pdf

[3] http://www.mathematik.uni-dortmund.de/~kuzmin/cfdintro/lecture7.pdf

 

 

 

Device Modeling and Simulation of sub-micron press-fit MOS Transistor

 

 

Introduction

 

Parts - Conductor (Au?,Al), Insulator (SiO2), Semiconductor (Si, n-Si, p-Si)

 

Back-End Simulation of Bricks Fabrication

 

Simulating physical stress, oxidation and dopant diffusion.

 

Oxidation and Boron Diffussion

 

 

 

 

 

 

 

Next, stress vs Boron diffusion

 

Electrical Properties

 

Deriving electrical properties: Carrier concentration, mobility, conductivity.

 

IV/CV measurement of press-fit metal-semiconductor junction, p-n junction and MOS capacitor.

 

 

(Note: Fabricatin - Deposition and lift-off, Doping - Ion Implant and Annealing)

 

Ref

1 - vasileska.faculty.asu.edu

2 - http://www.ddm.org/DD07/Micheletti_Quarteroni_Sacco.pdf

 

 

 

 

 

Project (Old Idea)