Saleem A. Al Dajani

Project Integration Updates (Day 2)

Cursor AI Transcript · HTMAA 2025

Table of Contents

Overview

Cursor AI assistance for Week 14 project integration updates, including Day 2 electrical and mechanical integration documentation, data integration methods refinement, and critical path analysis updates.

Full Conversation

User Unknown

follow the general guidelines:

— for each image or video add a caption and description.

— make all the text professional and succinct without losing key details

— make the information as organized and as aesthetically pleasing as possible

— don't just take my notes from the prompt, refine it before putting it on the page

specific tasks: (all in week14.html)

1-- update data integration section with the content in this chat (refine it as data integration methods to spirally develop)

let me know if you have any networking problems!

5:16

I have had success using paho mqtt

5:16

we can debug your webpage irght now if you want

Saleem Aldajani

5:18 PM

:pray:

kye

5:52 PM

https://wiki.seeedstudio.com/xiao_esp32s3_wifi_usage/#wifi-client-functions

WiFiClient::write(uint8_t data) -- Write a single byte of data to the connected server through the WiFiClient instance. Or WiFiClient::write(const uint8_t *buf, size_t size).

wiki.seeedstudio.comwiki.seeedstudio.com

WiFi for both versions | Seeed Studio Wiki

WiFi usage with Seeed Studio XIAO ESP32S3. (54 kB)

https://wiki.seeedstudio.com/xiao_esp32s3_wifi_usage/#wifi-client-functions

5:54

https://docs.arduino.cc/language-reference/en/functions/communication/serial/

Saleem Aldajani

5:56 PM

-- easiest serial through cable from computer to microcontroller and pyserial to stream the data

-- second easiest make all microcontrollers wifi clients and then stream to flash web server

2-- add a new section for day 2 electrical and mechanical integration

2.1. mechanical integration

mechanical design integration now includes the complete demo table with precise placement of the mirrorage handgrip subsystem and the aging clock subsystem, embed this image:

demo-table-v14.png

3d additive mechanical component prints were all put in for rapid iterative development, the casing print required organic support, the dock required a brim, the bands needed to print as TPU (will spiral into molding and casting)

printing-started.mp4

printing-case.jpeg

failed-case.jpeg

petg-bands.jpeg

failed-dock.jpeg

adding_brim.png

organic-support-case.png

case_organic_support.jpeg

fit-acrylic-case.jpeg

printing-failures.jpeg

printing-progress.jpeg

first 2d subtractive mechanical component was debugged, needed to export dxf of the full face to laser cut an acrylic display that fits the casing precisely (the display part face itself was too small because it was fileted, so i needed to trace the edges of the aging clock body and export and cut that face)

laser-cut-1.mp4

laser-cut-2.mp4

2.2 electrical integration

electrical design integration now combines the accelerometer/camera board with the pulse oximeter board all in one design that fits inside casing (might upgrade to small TFT screen later if it still fits in the casing)

board-too-big.png

board-in-case.png

final-board-design-aging-clock.png

the first version of the aging clock board was milled (which didnt fit the initial casing, can adjust the casing and print a slightly larger version or mill the new minitiarized board with shrunken electronics, and will try both today, now designing the mirrorage board for handgrip and speaker with large TFT screen

milled-integrated-aging-clock-board.jpeg

board-deflection-fixing.mp4

almost-fit-board.jpeg

Assistant Unknown

Reviewing week14.html and the week14/day2 directory to understand the current structure.

Updating the data integration section and adding the Day 2 section. Checking for any additional media files:

Updating the data integration section and adding the Day 2 section:




  
  
  Week 14 · Final Project
  
  


  
Saleem A. Al Dajani

Week 14

System Integration

Week Highlights

Final project integration week focused on bringing together all subsystems into a cohesive MirrorAge system, completing documentation, and preparing for final presentation.

Table of Contents

Week 14 System Integration

Final integration week focused on bringing all subsystems together, completing hardware fabrication, firmware integration, and documentation for the MirrorAge system presentation.

Week 14 Day-by-Day System Integration Plan

Positive Possum encouragement meme

Theme of the Week

FINITIATIVE

The act of bringing something to a conclusion or ending in a decisive manner. The ability to efficiently finish tasks and projects with a goal-oriented mindset.

Wednesday

Morning
  • Publish system integration plan on website
  • Update weekly assignment sections on final project page (weeks 10-13)
  • Link final project design files
  • Update reflections and learnings
  • Update picture of prism holder
  • Add final pictures to Slack canvases
  • Create schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Start CAD model of system
  • Place final order
Afternoon & Evening
Design:
  • Boards: Combine OLED screen/accelerometer with pulse oximeter board in a new board (maybe upgrade to small TFT as minor)
  • Boards: Speaker board with realtime amplifier and TFT (on the load cell fixed board)
  • Band: Mold design
  • Cases: 3D print mountable cases for the boards
  • Integrate designs into final CAD
  • Document design
  • Finish CAD model of system

Thursday

Fabricate
  • Milling boards
  • Print mold and cast band
  • Print cases
Solder
  • Solder components on milled boards
  • Connect boards with wired (and wireless connection codes)
Finishing
  • Mirror on screen (easy way with the film)
Documentation
  • Document fabrication

Friday

Programming
  • Board level codes
  • Server level codes
Documentation
  • Document codes
Completion
  • Finish anything else

Saturday

Programming & Testing
  • Demo integrated system
  • Test integrated system
Documentation
  • Document testing and evaluation
  • Review and complete documentation (list of questions)
  • Make the video by collaging documentation

Sunday

  • Fill up any gaps
  • Prepare demo on tensegrity table
  • Finalize 1-slide
  • Work on minors
  • If done, work on if there's time

Monday Morning

  • Transport demo on tensegrity table
  • Fill up any gaps
  • Work on minors

Specific Tasks to Complete This Week

Major Tasks
  • CAD model of system
  • Speaker board with realtime amplifier
  • Combine screen/accelerometer with pulse oximeter board in a new board
  • Mold and cast band
  • Design and fabricate casing (print)
  • Schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Serial connection between pulse oximeter and tiny blinking heart for BPM (BPM from IR, SpO2 from delta)
  • Combine multiple boards on the same WiFi (switching tabs is easy way, board hosting the webpage querying and update or Python-based server somewhere where everything posting data, Raspberry Pi)
  • Put+program everything together according to the above (with WiFi for now)
  • Mirror on screen (easy way with the film)
  • Document evaluations and costs (plus the rest of the list here: project presentation requirements)
  • Summary slide and one-minute video for documentation
    • Conception
    • Construction
    • Operation
Minor Tasks
  • Program microphone/speaker
  • Fix reaction time delay code
  • Program LoRa connection
  • Fix OLED plus WiFi issue
  • Upgrade to TFT (SPI is very straightforward, design board with either SPI or OLED connection)
  • Fix heart engraving to center
  • Engrave K9 glass mirror if it arrives
  • RD and IRD isolation slit (maybe wick and then cut)
  • Do the calibration curve for the load cell
  • Finish cardboard laser cutter origami big mirror frame
If There's Time
  • Moving base of mirror
Orders
  • Raspberry Pi Zero (or server host, do some research)
Presentation
  • Aim for 2.5 minutes because Neil will ask questions
  • Generally no slides except for 1 open summary slide (have backup slides in case questions come up!)

Related: See the Development Timeline on the final project page for the overall project schedule.

Day 1: Design Integration

Initial system integration work focused on subsystem validation, CAD model consolidation, and design backbone acquisition for band integration.

Subsystem Validation

Conducted comprehensive testing of all subsystems to ensure proper functionality. Identified and resoldered any defective joints, verifying that each subsystem operates correctly before proceeding with full system integration.

CAD Model Consolidation

Exported CAD models of all PCBs in the final design and imported them into a unified CAD assembly. This consolidated model provides a complete view of the system's mechanical integration and spatial relationships.

Exploded isometric view of the integrated CAD model showing all PCBs, housing components, and wearable band assembly
Integrated CAD Model: Exploded isometric view of the complete system assembly, including all PCBs (pulse oximeter, OLED/accelerometer, speaker/amplifier), main housing with transparent enclosure, and wearable band components. The model shows the spatial relationships between electronic subsystems and mechanical structures, enabling precise integration planning.

Band Design Backbone

Acquired CAD design files for Apple Watch form factor integration, enabling compatibility with existing band designs and standardized watch components. This provides a proven mechanical foundation for the wearable subsystem.

Apple Watch Form Factor: MutantW v2 Project · Instructables Guide
Apple Watch Band Design: Thingiverse Band Files

Next Steps

Resuming the daily schedule tomorrow with parallel work streams prioritized according to the critical path. Tasks that cannot be completed during scheduled days will be shifted to buffer days on Saturday and Sunday to maintain project momentum.

Critical Path Analysis

Project management view of the integration schedule, showing task dependencies, critical milestones, and current progress status.

Critical Path Tasks

Phase 1: Design & Documentation IN PROGRESS
  • CAD model consolidation and system integration design
  • PCB design: combine OLED/accelerometer with pulse oximeter
  • PCB design: speaker board with realtime amplifier and TFT
  • Band mold design
  • 3D printable cases for board mounting
  • System schematic documentation (wired and wireless)
  • Website documentation updates
Phase 2: Fabrication PENDING
  • PCB milling and component soldering
  • Band mold printing and casting
  • 3D printing of board cases
  • Mirror film application to screen
Phase 3: Integration & Programming PENDING
  • Board-level firmware integration
  • WiFi network coordination between boards
  • Server-level code development
  • Serial communication: pulse oximeter to heart display (BPM/SpO2)
  • System wiring and wireless connection setup
Phase 4: Testing & Documentation PENDING
  • Integrated system testing and validation
  • System evaluation and cost documentation
  • One-minute video production (conception, construction, operation)
  • Summary slide preparation
  • Final documentation review and completion

Current Status

Completed:

Subsystem testing and validation, CAD model consolidation, design backbone acquisition for band integration

In Progress:

PCB design consolidation, system schematic documentation, website updates

Upcoming:

PCB fabrication, band molding, firmware integration, system testing, final documentation

Buffer Days (Saturday & Sunday)

Tasks that cannot be completed during scheduled weekdays will be shifted to Saturday and Sunday buffer days. This ensures the critical path remains on schedule while allowing flexibility for unexpected delays or additional refinement work.

Data Integration Methods to Spirally Develop

Progressive development approach for integrating sensor data streams from multiple subsystems, starting with simple serial communication and evolving to wireless network-based architectures.

Method 1: Serial Communication (Easiest)

Direct serial communication through USB cable from computer to microcontroller, using PySerial to stream data. This provides the simplest initial integration path for rapid prototyping and debugging.

Implementation:
  • USB cable connection from computer to ESP32-S3 microcontroller
  • PySerial library for Python-based data streaming
  • Arduino Serial functions for microcontroller-side communication

Method 2: WiFi Client Architecture (Second Easiest)

Configure all microcontrollers as WiFi clients that stream data to a flash web server. This enables wireless communication while maintaining a centralized data aggregation point.

Implementation:
  • All ESP32-S3 boards configured as WiFi clients on the same network
  • Central web server (initially laptop-hosted) receives data streams
  • WiFiClient::write() functions for data transmission

Method 3: MQTT Protocol (Advanced)

Message Queuing Telemetry Transport (MQTT) provides a lightweight, publish-subscribe messaging protocol ideal for IoT device communication. This approach enables decentralized data exchange between all MirrorAge subsystems, allowing each board to publish sensor data and subscribe to relevant topics for coordinated system behavior.

Server Hosting Strategy:

Initial development and testing will use a laptop-hosted MQTT broker. In a later development spiral, the server will be migrated to a dedicated Raspberry Pi Zero or Raspberry Pi 5 for standalone operation and improved system portability. Paho MQTT library has been successfully tested for ESP32-S3 implementation.

Integration Strategy

Each subsystem board (pulse oximeter, OLED/accelerometer, speaker/amplifier, load cell) will publish sensor data to dedicated MQTT topics. A central interface or server component will subscribe to these topics, aggregate the data, and coordinate system-wide responses. This architecture enables:

  • Decoupled communication between subsystems
  • Real-time data streaming from multiple sensors
  • Scalable architecture for adding new sensor modules
  • Flexible server deployment (laptop → Raspberry Pi migration path)

Reflections & Learnings

Reflections and key learnings from the final project integration week.

Key Points

  • System integration requires careful coordination of mechanical, electrical, and software subsystems
  • Comprehensive planning and day-by-day scheduling are essential for managing complex integration tasks
  • Modular design enables incremental testing and validation of individual components before full system assembly
  • Documentation throughout the integration process supports debugging and future improvements
  • Final integration week demands focus, organization, and the ability to adapt to unexpected challenges

Contributions

Acknowledgments for contributions and collaborations during the final project week.

Ethical AI Use

Documentation of AI-assisted tasks and tools used during the final project integration week.

📋 General Guidelines: See General Commands for Cursor on the homepage for standard guidelines and commands used consistently throughout documentation development.

Cursor · Project Plan & Weekly Schedule

Comprehensive Cursor AI assistance for outlining the project plan and weekly schedule, including documentation structure, content organization, systematic updates across all week pages and the final project page, media integration, and summary generation workflows.

© Saleem A. Al Dajani
Made for HTMAA 2025 • Built with vanilla HTML/CSS

Updating the integration strategy section and adding the Day 2 section after Day 1:




  
  
  Week 14 · Final Project
  
  


  
Saleem A. Al Dajani

Week 14

System Integration

Week Highlights

Final project integration week focused on bringing together all subsystems into a cohesive MirrorAge system, completing documentation, and preparing for final presentation.

Table of Contents

Week 14 System Integration

Final integration week focused on bringing all subsystems together, completing hardware fabrication, firmware integration, and documentation for the MirrorAge system presentation.

Week 14 Day-by-Day System Integration Plan

Positive Possum encouragement meme

Theme of the Week

FINITIATIVE

The act of bringing something to a conclusion or ending in a decisive manner. The ability to efficiently finish tasks and projects with a goal-oriented mindset.

Wednesday

Morning
  • Publish system integration plan on website
  • Update weekly assignment sections on final project page (weeks 10-13)
  • Link final project design files
  • Update reflections and learnings
  • Update picture of prism holder
  • Add final pictures to Slack canvases
  • Create schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Start CAD model of system
  • Place final order
Afternoon & Evening
Design:
  • Boards: Combine OLED screen/accelerometer with pulse oximeter board in a new board (maybe upgrade to small TFT as minor)
  • Boards: Speaker board with realtime amplifier and TFT (on the load cell fixed board)
  • Band: Mold design
  • Cases: 3D print mountable cases for the boards
  • Integrate designs into final CAD
  • Document design
  • Finish CAD model of system

Thursday

Fabricate
  • Milling boards
  • Print mold and cast band
  • Print cases
Solder
  • Solder components on milled boards
  • Connect boards with wired (and wireless connection codes)
Finishing
  • Mirror on screen (easy way with the film)
Documentation
  • Document fabrication

Friday

Programming
  • Board level codes
  • Server level codes
Documentation
  • Document codes
Completion
  • Finish anything else

Saturday

Programming & Testing
  • Demo integrated system
  • Test integrated system
Documentation
  • Document testing and evaluation
  • Review and complete documentation (list of questions)
  • Make the video by collaging documentation

Sunday

  • Fill up any gaps
  • Prepare demo on tensegrity table
  • Finalize 1-slide
  • Work on minors
  • If done, work on if there's time

Monday Morning

  • Transport demo on tensegrity table
  • Fill up any gaps
  • Work on minors

Specific Tasks to Complete This Week

Major Tasks
  • CAD model of system
  • Speaker board with realtime amplifier
  • Combine screen/accelerometer with pulse oximeter board in a new board
  • Mold and cast band
  • Design and fabricate casing (print)
  • Schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Serial connection between pulse oximeter and tiny blinking heart for BPM (BPM from IR, SpO2 from delta)
  • Combine multiple boards on the same WiFi (switching tabs is easy way, board hosting the webpage querying and update or Python-based server somewhere where everything posting data, Raspberry Pi)
  • Put+program everything together according to the above (with WiFi for now)
  • Mirror on screen (easy way with the film)
  • Document evaluations and costs (plus the rest of the list here: project presentation requirements)
  • Summary slide and one-minute video for documentation
    • Conception
    • Construction
    • Operation
Minor Tasks
  • Program microphone/speaker
  • Fix reaction time delay code
  • Program LoRa connection
  • Fix OLED plus WiFi issue
  • Upgrade to TFT (SPI is very straightforward, design board with either SPI or OLED connection)
  • Fix heart engraving to center
  • Engrave K9 glass mirror if it arrives
  • RD and IRD isolation slit (maybe wick and then cut)
  • Do the calibration curve for the load cell
  • Finish cardboard laser cutter origami big mirror frame
If There's Time
  • Moving base of mirror
Orders
  • Raspberry Pi Zero (or server host, do some research)
Presentation
  • Aim for 2.5 minutes because Neil will ask questions
  • Generally no slides except for 1 open summary slide (have backup slides in case questions come up!)

Related: See the Development Timeline on the final project page for the overall project schedule.

Day 1: Design Integration

Initial system integration work focused on subsystem validation, CAD model consolidation, and design backbone acquisition for band integration.

Subsystem Validation

Conducted comprehensive testing of all subsystems to ensure proper functionality. Identified and resoldered any defective joints, verifying that each subsystem operates correctly before proceeding with full system integration.

CAD Model Consolidation

Exported CAD models of all PCBs in the final design and imported them into a unified CAD assembly. This consolidated model provides a complete view of the system's mechanical integration and spatial relationships.

Exploded isometric view of the integrated CAD model showing all PCBs, housing components, and wearable band assembly
Integrated CAD Model: Exploded isometric view of the complete system assembly, including all PCBs (pulse oximeter, OLED/accelerometer, speaker/amplifier), main housing with transparent enclosure, and wearable band components. The model shows the spatial relationships between electronic subsystems and mechanical structures, enabling precise integration planning.

Band Design Backbone

Acquired CAD design files for Apple Watch form factor integration, enabling compatibility with existing band designs and standardized watch components. This provides a proven mechanical foundation for the wearable subsystem.

Apple Watch Form Factor: MutantW v2 Project · Instructables Guide
Apple Watch Band Design: Thingiverse Band Files

Next Steps

Resuming the daily schedule tomorrow with parallel work streams prioritized according to the critical path. Tasks that cannot be completed during scheduled days will be shifted to buffer days on Saturday and Sunday to maintain project momentum.

Critical Path Analysis

Project management view of the integration schedule, showing task dependencies, critical milestones, and current progress status.

Critical Path Tasks

Phase 1: Design & Documentation IN PROGRESS
  • CAD model consolidation and system integration design
  • PCB design: combine OLED/accelerometer with pulse oximeter
  • PCB design: speaker board with realtime amplifier and TFT
  • Band mold design
  • 3D printable cases for board mounting
  • System schematic documentation (wired and wireless)
  • Website documentation updates
Phase 2: Fabrication PENDING
  • PCB milling and component soldering
  • Band mold printing and casting
  • 3D printing of board cases
  • Mirror film application to screen
Phase 3: Integration & Programming PENDING
  • Board-level firmware integration
  • WiFi network coordination between boards
  • Server-level code development
  • Serial communication: pulse oximeter to heart display (BPM/SpO2)
  • System wiring and wireless connection setup
Phase 4: Testing & Documentation PENDING
  • Integrated system testing and validation
  • System evaluation and cost documentation
  • One-minute video production (conception, construction, operation)
  • Summary slide preparation
  • Final documentation review and completion

Current Status

Completed:

Subsystem testing and validation, CAD model consolidation, design backbone acquisition for band integration

In Progress:

PCB design consolidation, system schematic documentation, website updates

Upcoming:

PCB fabrication, band molding, firmware integration, system testing, final documentation

Buffer Days (Saturday & Sunday)

Tasks that cannot be completed during scheduled weekdays will be shifted to Saturday and Sunday buffer days. This ensures the critical path remains on schedule while allowing flexibility for unexpected delays or additional refinement work.

Data Integration Methods to Spirally Develop

Progressive development approach for integrating sensor data streams from multiple subsystems, starting with simple serial communication and evolving to wireless network-based architectures.

Method 1: Serial Communication (Easiest)

Direct serial communication through USB cable from computer to microcontroller, using PySerial to stream data. This provides the simplest initial integration path for rapid prototyping and debugging.

Implementation:
  • USB cable connection from computer to ESP32-S3 microcontroller
  • PySerial library for Python-based data streaming
  • Arduino Serial functions for microcontroller-side communication

Method 2: WiFi Client Architecture (Second Easiest)

Configure all microcontrollers as WiFi clients that stream data to a flash web server. This enables wireless communication while maintaining a centralized data aggregation point.

Implementation:
  • All ESP32-S3 boards configured as WiFi clients on the same network
  • Central web server (initially laptop-hosted) receives data streams
  • WiFiClient::write() functions for data transmission

Method 3: MQTT Protocol (Advanced)

Message Queuing Telemetry Transport (MQTT) provides a lightweight, publish-subscribe messaging protocol ideal for IoT device communication. This approach enables decentralized data exchange between all MirrorAge subsystems, allowing each board to publish sensor data and subscribe to relevant topics for coordinated system behavior.

Server Hosting Strategy:

Initial development and testing will use a laptop-hosted MQTT broker. In a later development spiral, the server will be migrated to a dedicated Raspberry Pi Zero or Raspberry Pi 5 for standalone operation and improved system portability. Paho MQTT library has been successfully tested for ESP32-S3 implementation.

Spiral Development Approach

Development will progress through these methods in order of complexity, starting with serial communication for rapid prototyping, then moving to WiFi client architecture for wireless operation, and finally implementing MQTT for advanced decentralized communication. Each subsystem board (pulse oximeter, OLED/accelerometer, speaker/amplifier, load cell) will be integrated progressively, enabling:

  • Incremental complexity management and early validation
  • Decoupled communication between subsystems
  • Real-time data streaming from multiple sensors
  • Scalable architecture for adding new sensor modules
  • Flexible server deployment (laptop → Raspberry Pi migration path)

Reflections & Learnings

Reflections and key learnings from the final project integration week.

Key Points

  • System integration requires careful coordination of mechanical, electrical, and software subsystems
  • Comprehensive planning and day-by-day scheduling are essential for managing complex integration tasks
  • Modular design enables incremental testing and validation of individual components before full system assembly
  • Documentation throughout the integration process supports debugging and future improvements
  • Final integration week demands focus, organization, and the ability to adapt to unexpected challenges

Contributions

Acknowledgments for contributions and collaborations during the final project week.

Ethical AI Use

Documentation of AI-assisted tasks and tools used during the final project integration week.

📋 General Guidelines: See General Commands for Cursor on the homepage for standard guidelines and commands used consistently throughout documentation development.

Cursor · Project Plan & Weekly Schedule

Comprehensive Cursor AI assistance for outlining the project plan and weekly schedule, including documentation structure, content organization, systematic updates across all week pages and the final project page, media integration, and summary generation workflows.

© Saleem A. Al Dajani
Made for HTMAA 2025 • Built with vanilla HTML/CSS



  
  
  Week 14 · Final Project
  
  


  
Saleem A. Al Dajani

Week 14

System Integration

Week Highlights

Final project integration week focused on bringing together all subsystems into a cohesive MirrorAge system, completing documentation, and preparing for final presentation.

Table of Contents

Week 14 System Integration

Final integration week focused on bringing all subsystems together, completing hardware fabrication, firmware integration, and documentation for the MirrorAge system presentation.

Week 14 Day-by-Day System Integration Plan

Positive Possum encouragement meme

Theme of the Week

FINITIATIVE

The act of bringing something to a conclusion or ending in a decisive manner. The ability to efficiently finish tasks and projects with a goal-oriented mindset.

Wednesday

Morning
  • Publish system integration plan on website
  • Update weekly assignment sections on final project page (weeks 10-13)
  • Link final project design files
  • Update reflections and learnings
  • Update picture of prism holder
  • Add final pictures to Slack canvases
  • Create schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Start CAD model of system
  • Place final order
Afternoon & Evening
Design:
  • Boards: Combine OLED screen/accelerometer with pulse oximeter board in a new board (maybe upgrade to small TFT as minor)
  • Boards: Speaker board with realtime amplifier and TFT (on the load cell fixed board)
  • Band: Mold design
  • Cases: 3D print mountable cases for the boards
  • Integrate designs into final CAD
  • Document design
  • Finish CAD model of system

Thursday

Fabricate
  • Milling boards
  • Print mold and cast band
  • Print cases
Solder
  • Solder components on milled boards
  • Connect boards with wired (and wireless connection codes)
Finishing
  • Mirror on screen (easy way with the film)
Documentation
  • Document fabrication

Friday

Programming
  • Board level codes
  • Server level codes
Documentation
  • Document codes
Completion
  • Finish anything else

Saturday

Programming & Testing
  • Demo integrated system
  • Test integrated system
Documentation
  • Document testing and evaluation
  • Review and complete documentation (list of questions)
  • Make the video by collaging documentation

Sunday

  • Fill up any gaps
  • Prepare demo on tensegrity table
  • Finalize 1-slide
  • Work on minors
  • If done, work on if there's time

Monday Morning

  • Transport demo on tensegrity table
  • Fill up any gaps
  • Work on minors

Specific Tasks to Complete This Week

Major Tasks
  • CAD model of system
  • Speaker board with realtime amplifier
  • Combine screen/accelerometer with pulse oximeter board in a new board
  • Mold and cast band
  • Design and fabricate casing (print)
  • Schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Serial connection between pulse oximeter and tiny blinking heart for BPM (BPM from IR, SpO2 from delta)
  • Combine multiple boards on the same WiFi (switching tabs is easy way, board hosting the webpage querying and update or Python-based server somewhere where everything posting data, Raspberry Pi)
  • Put+program everything together according to the above (with WiFi for now)
  • Mirror on screen (easy way with the film)
  • Document evaluations and costs (plus the rest of the list here: project presentation requirements)
  • Summary slide and one-minute video for documentation
    • Conception
    • Construction
    • Operation
Minor Tasks
  • Program microphone/speaker
  • Fix reaction time delay code
  • Program LoRa connection
  • Fix OLED plus WiFi issue
  • Upgrade to TFT (SPI is very straightforward, design board with either SPI or OLED connection)
  • Fix heart engraving to center
  • Engrave K9 glass mirror if it arrives
  • RD and IRD isolation slit (maybe wick and then cut)
  • Do the calibration curve for the load cell
  • Finish cardboard laser cutter origami big mirror frame
If There's Time
  • Moving base of mirror
Orders
  • Raspberry Pi Zero (or server host, do some research)
Presentation
  • Aim for 2.5 minutes because Neil will ask questions
  • Generally no slides except for 1 open summary slide (have backup slides in case questions come up!)

Related: See the Development Timeline on the final project page for the overall project schedule.

Day 1: Design Integration

Initial system integration work focused on subsystem validation, CAD model consolidation, and design backbone acquisition for band integration.

Subsystem Validation

Conducted comprehensive testing of all subsystems to ensure proper functionality. Identified and resoldered any defective joints, verifying that each subsystem operates correctly before proceeding with full system integration.

CAD Model Consolidation

Exported CAD models of all PCBs in the final design and imported them into a unified CAD assembly. This consolidated model provides a complete view of the system's mechanical integration and spatial relationships.

Exploded isometric view of the integrated CAD model showing all PCBs, housing components, and wearable band assembly
Integrated CAD Model: Exploded isometric view of the complete system assembly, including all PCBs (pulse oximeter, OLED/accelerometer, speaker/amplifier), main housing with transparent enclosure, and wearable band components. The model shows the spatial relationships between electronic subsystems and mechanical structures, enabling precise integration planning.

Band Design Backbone

Acquired CAD design files for Apple Watch form factor integration, enabling compatibility with existing band designs and standardized watch components. This provides a proven mechanical foundation for the wearable subsystem.

Apple Watch Form Factor: MutantW v2 Project · Instructables Guide
Apple Watch Band Design: Thingiverse Band Files

Next Steps

Resuming the daily schedule tomorrow with parallel work streams prioritized according to the critical path. Tasks that cannot be completed during scheduled days will be shifted to buffer days on Saturday and Sunday to maintain project momentum.

Day 2: Electrical and Mechanical Integration

Physical integration of subsystems into the complete demo table assembly, including mechanical component fabrication and electrical board consolidation.

2.1 Mechanical Integration

Mechanical design integration now includes the complete demo table with precise placement of the MirrorAge handgrip subsystem and the aging clock subsystem. The integrated assembly provides a unified platform for system demonstration and testing.

Complete demo table assembly showing integrated MirrorAge handgrip and aging clock subsystems
Complete Demo Table Assembly: Integrated mechanical design showing precise placement of the MirrorAge handgrip subsystem and aging clock subsystem on the demo table. The assembly demonstrates the spatial relationships and mounting configurations for both subsystems within the unified demonstration platform.

3D Additive Manufacturing

All 3D additive mechanical components were printed for rapid iterative development. The fabrication process required specific print settings and support strategies for different components:

Printing Initiation: 3D printer starting the fabrication process for mechanical components
3D printed casing component during fabrication
Casing Print: Casing component during 3D printing process
Print Configuration Requirements:
  • Casing: Required organic support structures for complex overhangs
  • Dock: Required brim adhesion to prevent warping during printing
  • Bands: Printed using TPU (Thermoplastic Polyurethane) material for flexibility (will spiral into molding and casting in future iterations)
Organic support structure configuration for casing print
Organic Support Configuration: Slicer settings showing organic support structures for the casing component
Brim addition to dock component for improved bed adhesion
Brim Addition: Dock component with brim added to prevent warping during printing
Casing component with organic support structures
Casing with Organic Support: Printed casing component showing organic support structures
TPU bands printed for flexible wearable components
TPU Bands: Flexible wearable band components printed using TPU material
Print Failures and Iteration
Failed casing print showing print quality issues
Failed Casing Print: Initial casing print failure requiring support structure adjustments
Failed dock print showing warping issues
Failed Dock Print: Dock print failure due to warping, resolved with brim addition
Collection of printing failures and debugging process
Printing Failures: Documentation of various print failures encountered during iterative development
Successful printing progress showing completed components
Printing Progress: Successful components showing iterative improvement in print quality

2D Subtractive Manufacturing

The first 2D subtractive mechanical component was debugged and fabricated. The display face component required exporting a DXF of the full face to laser cut an acrylic display that fits the casing precisely. The original display part face was too small because it was filleted, so the edges of the aging clock body were traced and exported for accurate laser cutting.

Laser Cutting Process 1: Initial laser cutting of acrylic display component
Laser Cutting Process 2: Continued laser cutting operation for display face
Acrylic display component fitted into casing
Acrylic Display Fit: Laser-cut acrylic display component precisely fitted into the casing, demonstrating successful integration of 2D subtractive and 3D additive manufacturing components.

2.2 Electrical Integration

Electrical design integration now combines the accelerometer/camera board with the pulse oximeter board into a single unified design that fits inside the casing. The integrated board may be upgraded to include a small TFT screen in a future iteration if space constraints allow.

Board Design Evolution

Initial board design showing size constraints
Initial Board Design: First integrated board design showing size constraints relative to casing dimensions
Board design fitted within casing constraints
Board in Casing: Revised board design fitted within casing dimensional constraints
Final integrated aging clock board design
Final Integrated Board Design: Complete aging clock board design combining accelerometer/camera functionality with pulse oximeter sensors in a single unified PCB layout optimized for casing fit and component placement.

Board Fabrication and Integration

The first version of the aging clock board was milled. The initial board did not fit the casing, requiring either casing adjustment and reprinting, or milling a new miniaturized board with shrunken electronics. Both approaches are being evaluated. Currently designing the MirrorAge board for handgrip and speaker with large TFT screen integration.

Milled integrated aging clock board showing component placement
Milled Integrated Board: First version of the integrated aging clock board after PCB milling, showing component placement and routing
Board nearly fitting in casing showing dimensional constraints
Board Fit Test: Milled board nearly fitting in casing, demonstrating the need for dimensional optimization
Board Deflection Fixing: Process of addressing board deflection and mechanical fit issues during integration testing, demonstrating iterative refinement of the electrical-mechanical interface.

Critical Path Analysis

Project management view of the integration schedule, showing task dependencies, critical milestones, and current progress status.

Critical Path Tasks

Phase 1: Design & Documentation IN PROGRESS
  • CAD model consolidation and system integration design
  • PCB design: combine OLED/accelerometer with pulse oximeter
  • PCB design: speaker board with realtime amplifier and TFT
  • Band mold design
  • 3D printable cases for board mounting
  • System schematic documentation (wired and wireless)
  • Website documentation updates
Phase 2: Fabrication PENDING
  • PCB milling and component soldering
  • Band mold printing and casting
  • 3D printing of board cases
  • Mirror film application to screen
Phase 3: Integration & Programming PENDING
  • Board-level firmware integration
  • WiFi network coordination between boards
  • Server-level code development
  • Serial communication: pulse oximeter to heart display (BPM/SpO2)
  • System wiring and wireless connection setup
Phase 4: Testing & Documentation PENDING
  • Integrated system testing and validation
  • System evaluation and cost documentation
  • One-minute video production (conception, construction, operation)
  • Summary slide preparation
  • Final documentation review and completion

Current Status

Completed:

Subsystem testing and validation, CAD model consolidation, design backbone acquisition for band integration

In Progress:

PCB design consolidation, system schematic documentation, website updates

Upcoming:

PCB fabrication, band molding, firmware integration, system testing, final documentation

Buffer Days (Saturday & Sunday)

Tasks that cannot be completed during scheduled weekdays will be shifted to Saturday and Sunday buffer days. This ensures the critical path remains on schedule while allowing flexibility for unexpected delays or additional refinement work.

Data Integration Methods to Spirally Develop

Progressive development approach for integrating sensor data streams from multiple subsystems, starting with simple serial communication and evolving to wireless network-based architectures.

Method 1: Serial Communication (Easiest)

Direct serial communication through USB cable from computer to microcontroller, using PySerial to stream data. This provides the simplest initial integration path for rapid prototyping and debugging.

Implementation:
  • USB cable connection from computer to ESP32-S3 microcontroller
  • PySerial library for Python-based data streaming
  • Arduino Serial functions for microcontroller-side communication

Method 2: WiFi Client Architecture (Second Easiest)

Configure all microcontrollers as WiFi clients that stream data to a flash web server. This enables wireless communication while maintaining a centralized data aggregation point.

Implementation:
  • All ESP32-S3 boards configured as WiFi clients on the same network
  • Central web server (initially laptop-hosted) receives data streams
  • WiFiClient::write() functions for data transmission

Method 3: MQTT Protocol (Advanced)

Message Queuing Telemetry Transport (MQTT) provides a lightweight, publish-subscribe messaging protocol ideal for IoT device communication. This approach enables decentralized data exchange between all MirrorAge subsystems, allowing each board to publish sensor data and subscribe to relevant topics for coordinated system behavior.

Server Hosting Strategy:

Initial development and testing will use a laptop-hosted MQTT broker. In a later development spiral, the server will be migrated to a dedicated Raspberry Pi Zero or Raspberry Pi 5 for standalone operation and improved system portability. Paho MQTT library has been successfully tested for ESP32-S3 implementation.

Spiral Development Approach

Development will progress through these methods in order of complexity, starting with serial communication for rapid prototyping, then moving to WiFi client architecture for wireless operation, and finally implementing MQTT for advanced decentralized communication. Each subsystem board (pulse oximeter, OLED/accelerometer, speaker/amplifier, load cell) will be integrated progressively, enabling:

  • Incremental complexity management and early validation
  • Decoupled communication between subsystems
  • Real-time data streaming from multiple sensors
  • Scalable architecture for adding new sensor modules
  • Flexible server deployment (laptop → Raspberry Pi migration path)

Reflections & Learnings

Reflections and key learnings from the final project integration week.

Key Points

  • System integration requires careful coordination of mechanical, electrical, and software subsystems
  • Comprehensive planning and day-by-day scheduling are essential for managing complex integration tasks
  • Modular design enables incremental testing and validation of individual components before full system assembly
  • Documentation throughout the integration process supports debugging and future improvements
  • Final integration week demands focus, organization, and the ability to adapt to unexpected challenges

Contributions

Acknowledgments for contributions and collaborations during the final project week.

Ethical AI Use

Documentation of AI-assisted tasks and tools used during the final project integration week.

📋 General Guidelines: See General Commands for Cursor on the homepage for standard guidelines and commands used consistently throughout documentation development.

Cursor · Project Plan & Weekly Schedule

Comprehensive Cursor AI assistance for outlining the project plan and weekly schedule, including documentation structure, content organization, systematic updates across all week pages and the final project page, media integration, and summary generation workflows.

© Saleem A. Al Dajani
Made for HTMAA 2025 • Built with vanilla HTML/CSS

Updating the table of contents to include the Day 2 section:




  
  
  Week 14 · Final Project
  
  


  
Saleem A. Al Dajani

Week 14

System Integration

Week Highlights

Final project integration week focused on bringing together all subsystems into a cohesive MirrorAge system, completing documentation, and preparing for final presentation.

Table of Contents

Week 14 System Integration

Final integration week focused on bringing all subsystems together, completing hardware fabrication, firmware integration, and documentation for the MirrorAge system presentation.

Week 14 Day-by-Day System Integration Plan

Positive Possum encouragement meme

Theme of the Week

FINITIATIVE

The act of bringing something to a conclusion or ending in a decisive manner. The ability to efficiently finish tasks and projects with a goal-oriented mindset.

Wednesday

Morning
  • Publish system integration plan on website
  • Update weekly assignment sections on final project page (weeks 10-13)
  • Link final project design files
  • Update reflections and learnings
  • Update picture of prism holder
  • Add final pictures to Slack canvases
  • Create schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Start CAD model of system
  • Place final order
Afternoon & Evening
Design:
  • Boards: Combine OLED screen/accelerometer with pulse oximeter board in a new board (maybe upgrade to small TFT as minor)
  • Boards: Speaker board with realtime amplifier and TFT (on the load cell fixed board)
  • Band: Mold design
  • Cases: 3D print mountable cases for the boards
  • Integrate designs into final CAD
  • Document design
  • Finish CAD model of system

Thursday

Fabricate
  • Milling boards
  • Print mold and cast band
  • Print cases
Solder
  • Solder components on milled boards
  • Connect boards with wired (and wireless connection codes)
Finishing
  • Mirror on screen (easy way with the film)
Documentation
  • Document fabrication

Friday

Programming
  • Board level codes
  • Server level codes
Documentation
  • Document codes
Completion
  • Finish anything else

Saturday

Programming & Testing
  • Demo integrated system
  • Test integrated system
Documentation
  • Document testing and evaluation
  • Review and complete documentation (list of questions)
  • Make the video by collaging documentation

Sunday

  • Fill up any gaps
  • Prepare demo on tensegrity table
  • Finalize 1-slide
  • Work on minors
  • If done, work on if there's time

Monday Morning

  • Transport demo on tensegrity table
  • Fill up any gaps
  • Work on minors

Specific Tasks to Complete This Week

Major Tasks
  • CAD model of system
  • Speaker board with realtime amplifier
  • Combine screen/accelerometer with pulse oximeter board in a new board
  • Mold and cast band
  • Design and fabricate casing (print)
  • Schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Serial connection between pulse oximeter and tiny blinking heart for BPM (BPM from IR, SpO2 from delta)
  • Combine multiple boards on the same WiFi (switching tabs is easy way, board hosting the webpage querying and update or Python-based server somewhere where everything posting data, Raspberry Pi)
  • Put+program everything together according to the above (with WiFi for now)
  • Mirror on screen (easy way with the film)
  • Document evaluations and costs (plus the rest of the list here: project presentation requirements)
  • Summary slide and one-minute video for documentation
    • Conception
    • Construction
    • Operation
Minor Tasks
  • Program microphone/speaker
  • Fix reaction time delay code
  • Program LoRa connection
  • Fix OLED plus WiFi issue
  • Upgrade to TFT (SPI is very straightforward, design board with either SPI or OLED connection)
  • Fix heart engraving to center
  • Engrave K9 glass mirror if it arrives
  • RD and IRD isolation slit (maybe wick and then cut)
  • Do the calibration curve for the load cell
  • Finish cardboard laser cutter origami big mirror frame
If There's Time
  • Moving base of mirror
Orders
  • Raspberry Pi Zero (or server host, do some research)
Presentation
  • Aim for 2.5 minutes because Neil will ask questions
  • Generally no slides except for 1 open summary slide (have backup slides in case questions come up!)

Related: See the Development Timeline on the final project page for the overall project schedule.

Day 1: Design Integration

Initial system integration work focused on subsystem validation, CAD model consolidation, and design backbone acquisition for band integration.

Subsystem Validation

Conducted comprehensive testing of all subsystems to ensure proper functionality. Identified and resoldered any defective joints, verifying that each subsystem operates correctly before proceeding with full system integration.

CAD Model Consolidation

Exported CAD models of all PCBs in the final design and imported them into a unified CAD assembly. This consolidated model provides a complete view of the system's mechanical integration and spatial relationships.

Exploded isometric view of the integrated CAD model showing all PCBs, housing components, and wearable band assembly
Integrated CAD Model: Exploded isometric view of the complete system assembly, including all PCBs (pulse oximeter, OLED/accelerometer, speaker/amplifier), main housing with transparent enclosure, and wearable band components. The model shows the spatial relationships between electronic subsystems and mechanical structures, enabling precise integration planning.

Band Design Backbone

Acquired CAD design files for Apple Watch form factor integration, enabling compatibility with existing band designs and standardized watch components. This provides a proven mechanical foundation for the wearable subsystem.

Apple Watch Form Factor: MutantW v2 Project · Instructables Guide
Apple Watch Band Design: Thingiverse Band Files

Next Steps

Resuming the daily schedule tomorrow with parallel work streams prioritized according to the critical path. Tasks that cannot be completed during scheduled days will be shifted to buffer days on Saturday and Sunday to maintain project momentum.

Day 2: Electrical and Mechanical Integration

Physical integration of subsystems into the complete demo table assembly, including mechanical component fabrication and electrical board consolidation.

2.1 Mechanical Integration

Mechanical design integration now includes the complete demo table with precise placement of the MirrorAge handgrip subsystem and the aging clock subsystem. The integrated assembly provides a unified platform for system demonstration and testing.

Complete demo table assembly showing integrated MirrorAge handgrip and aging clock subsystems
Complete Demo Table Assembly: Integrated mechanical design showing precise placement of the MirrorAge handgrip subsystem and aging clock subsystem on the demo table. The assembly demonstrates the spatial relationships and mounting configurations for both subsystems within the unified demonstration platform.

3D Additive Manufacturing

All 3D additive mechanical components were printed for rapid iterative development. The fabrication process required specific print settings and support strategies for different components:

Printing Initiation: 3D printer starting the fabrication process for mechanical components
3D printed casing component during fabrication
Casing Print: Casing component during 3D printing process
Print Configuration Requirements:
  • Casing: Required organic support structures for complex overhangs
  • Dock: Required brim adhesion to prevent warping during printing
  • Bands: Printed using TPU (Thermoplastic Polyurethane) material for flexibility (will spiral into molding and casting in future iterations)
Organic support structure configuration for casing print
Organic Support Configuration: Slicer settings showing organic support structures for the casing component
Brim addition to dock component for improved bed adhesion
Brim Addition: Dock component with brim added to prevent warping during printing
Casing component with organic support structures
Casing with Organic Support: Printed casing component showing organic support structures
TPU bands printed for flexible wearable components
TPU Bands: Flexible wearable band components printed using TPU material
Print Failures and Iteration
Failed casing print showing print quality issues
Failed Casing Print: Initial casing print failure requiring support structure adjustments
Failed dock print showing warping issues
Failed Dock Print: Dock print failure due to warping, resolved with brim addition
Collection of printing failures and debugging process
Printing Failures: Documentation of various print failures encountered during iterative development
Successful printing progress showing completed components
Printing Progress: Successful components showing iterative improvement in print quality

2D Subtractive Manufacturing

The first 2D subtractive mechanical component was debugged and fabricated. The display face component required exporting a DXF of the full face to laser cut an acrylic display that fits the casing precisely. The original display part face was too small because it was filleted, so the edges of the aging clock body were traced and exported for accurate laser cutting.

Laser Cutting Process 1: Initial laser cutting of acrylic display component
Laser Cutting Process 2: Continued laser cutting operation for display face
Acrylic display component fitted into casing
Acrylic Display Fit: Laser-cut acrylic display component precisely fitted into the casing, demonstrating successful integration of 2D subtractive and 3D additive manufacturing components.

2.2 Electrical Integration

Electrical design integration now combines the accelerometer/camera board with the pulse oximeter board into a single unified design that fits inside the casing. The integrated board may be upgraded to include a small TFT screen in a future iteration if space constraints allow.

Board Design Evolution

Initial board design showing size constraints
Initial Board Design: First integrated board design showing size constraints relative to casing dimensions
Board design fitted within casing constraints
Board in Casing: Revised board design fitted within casing dimensional constraints
Final integrated aging clock board design
Final Integrated Board Design: Complete aging clock board design combining accelerometer/camera functionality with pulse oximeter sensors in a single unified PCB layout optimized for casing fit and component placement.

Board Fabrication and Integration

The first version of the aging clock board was milled. The initial board did not fit the casing, requiring either casing adjustment and reprinting, or milling a new miniaturized board with shrunken electronics. Both approaches are being evaluated. Currently designing the MirrorAge board for handgrip and speaker with large TFT screen integration.

Milled integrated aging clock board showing component placement
Milled Integrated Board: First version of the integrated aging clock board after PCB milling, showing component placement and routing
Board nearly fitting in casing showing dimensional constraints
Board Fit Test: Milled board nearly fitting in casing, demonstrating the need for dimensional optimization
Board Deflection Fixing: Process of addressing board deflection and mechanical fit issues during integration testing, demonstrating iterative refinement of the electrical-mechanical interface.

Critical Path Analysis

Project management view of the integration schedule, showing task dependencies, critical milestones, and current progress status.

Critical Path Tasks

Phase 1: Design & Documentation IN PROGRESS
  • CAD model consolidation and system integration design
  • PCB design: combine OLED/accelerometer with pulse oximeter
  • PCB design: speaker board with realtime amplifier and TFT
  • Band mold design
  • 3D printable cases for board mounting
  • System schematic documentation (wired and wireless)
  • Website documentation updates
Phase 2: Fabrication PENDING
  • PCB milling and component soldering
  • Band mold printing and casting
  • 3D printing of board cases
  • Mirror film application to screen
Phase 3: Integration & Programming PENDING
  • Board-level firmware integration
  • WiFi network coordination between boards
  • Server-level code development
  • Serial communication: pulse oximeter to heart display (BPM/SpO2)
  • System wiring and wireless connection setup
Phase 4: Testing & Documentation PENDING
  • Integrated system testing and validation
  • System evaluation and cost documentation
  • One-minute video production (conception, construction, operation)
  • Summary slide preparation
  • Final documentation review and completion

Current Status

Completed:

Subsystem testing and validation, CAD model consolidation, design backbone acquisition for band integration

In Progress:

PCB design consolidation, system schematic documentation, website updates

Upcoming:

PCB fabrication, band molding, firmware integration, system testing, final documentation

Buffer Days (Saturday & Sunday)

Tasks that cannot be completed during scheduled weekdays will be shifted to Saturday and Sunday buffer days. This ensures the critical path remains on schedule while allowing flexibility for unexpected delays or additional refinement work.

Data Integration Methods to Spirally Develop

Progressive development approach for integrating sensor data streams from multiple subsystems, starting with simple serial communication and evolving to wireless network-based architectures.

Method 1: Serial Communication (Easiest)

Direct serial communication through USB cable from computer to microcontroller, using PySerial to stream data. This provides the simplest initial integration path for rapid prototyping and debugging.

Implementation:
  • USB cable connection from computer to ESP32-S3 microcontroller
  • PySerial library for Python-based data streaming
  • Arduino Serial functions for microcontroller-side communication

Method 2: WiFi Client Architecture (Second Easiest)

Configure all microcontrollers as WiFi clients that stream data to a flash web server. This enables wireless communication while maintaining a centralized data aggregation point.

Implementation:
  • All ESP32-S3 boards configured as WiFi clients on the same network
  • Central web server (initially laptop-hosted) receives data streams
  • WiFiClient::write() functions for data transmission

Method 3: MQTT Protocol (Advanced)

Message Queuing Telemetry Transport (MQTT) provides a lightweight, publish-subscribe messaging protocol ideal for IoT device communication. This approach enables decentralized data exchange between all MirrorAge subsystems, allowing each board to publish sensor data and subscribe to relevant topics for coordinated system behavior.

Server Hosting Strategy:

Initial development and testing will use a laptop-hosted MQTT broker. In a later development spiral, the server will be migrated to a dedicated Raspberry Pi Zero or Raspberry Pi 5 for standalone operation and improved system portability. Paho MQTT library has been successfully tested for ESP32-S3 implementation.

Spiral Development Approach

Development will progress through these methods in order of complexity, starting with serial communication for rapid prototyping, then moving to WiFi client architecture for wireless operation, and finally implementing MQTT for advanced decentralized communication. Each subsystem board (pulse oximeter, OLED/accelerometer, speaker/amplifier, load cell) will be integrated progressively, enabling:

  • Incremental complexity management and early validation
  • Decoupled communication between subsystems
  • Real-time data streaming from multiple sensors
  • Scalable architecture for adding new sensor modules
  • Flexible server deployment (laptop → Raspberry Pi migration path)

Reflections & Learnings

Reflections and key learnings from the final project integration week.

Key Points

  • System integration requires careful coordination of mechanical, electrical, and software subsystems
  • Comprehensive planning and day-by-day scheduling are essential for managing complex integration tasks
  • Modular design enables incremental testing and validation of individual components before full system assembly
  • Documentation throughout the integration process supports debugging and future improvements
  • Final integration week demands focus, organization, and the ability to adapt to unexpected challenges

Contributions

Acknowledgments for contributions and collaborations during the final project week.

Ethical AI Use

Documentation of AI-assisted tasks and tools used during the final project integration week.

📋 General Guidelines: See General Commands for Cursor on the homepage for standard guidelines and commands used consistently throughout documentation development.

Cursor · Project Plan & Weekly Schedule

Comprehensive Cursor AI assistance for outlining the project plan and weekly schedule, including documentation structure, content organization, systematic updates across all week pages and the final project page, media integration, and summary generation workflows.

© Saleem A. Al Dajani
Made for HTMAA 2025 • Built with vanilla HTML/CSS

Summary of Changes

1. Updated Data Integration Section (now titled "Data Integration Methods to Spirally Develop"): - Reframed as a spiral development approach - Added three methods in order of complexity: - Method 1: Serial Communication (easiest) — USB cable with PySerial - Method 2: WiFi Client Architecture — all microcontrollers as WiFi clients streaming to a web server - Method 3: MQTT Protocol (advanced) — with notes on Paho MQTT success - Included relevant documentation links - Updated the strategy section to emphasize incremental development

2. Added Day 2: Electrical and Mechanical Integration Section: - 2.1 Mechanical Integration: - Demo table integration with image and caption - 3D additive manufacturing: printing process, support/brim requirements, failures, and progress - 2D subtractive manufacturing: laser cutting process with videos and final fit - 2.2 Electrical Integration: - Board design evolution showing size constraints and final design - Board fabrication: milling process, fit testing, and deflection fixing

3. Updated Table of Contents: Added link to the new Day 2 section

All images and videos include captions and descriptions. Text is concise and organized. The content follows the spiral development approach and maintains consistency with the existing page style.

User Unknown

update critical path analysis based on what's been added to the page now

Assistant Unknown

Reviewing the Critical Path Analysis section and updating it to reflect Day 1 and Day 2 progress.

Updating the Critical Path Analysis to reflect Day 1 and Day 2 progress:




  
  
  Week 14 · Final Project
  
  


  
Saleem A. Al Dajani

Week 14

System Integration

Week Highlights

Final project integration week focused on bringing together all subsystems into a cohesive MirrorAge system, completing documentation, and preparing for final presentation.

Table of Contents

Week 14 System Integration

Final integration week focused on bringing all subsystems together, completing hardware fabrication, firmware integration, and documentation for the MirrorAge system presentation.

Week 14 Day-by-Day System Integration Plan

Positive Possum encouragement meme

Theme of the Week

FINITIATIVE

The act of bringing something to a conclusion or ending in a decisive manner. The ability to efficiently finish tasks and projects with a goal-oriented mindset.

Wednesday

Morning
  • Publish system integration plan on website
  • Update weekly assignment sections on final project page (weeks 10-13)
  • Link final project design files
  • Update reflections and learnings
  • Update picture of prism holder
  • Add final pictures to Slack canvases
  • Create schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Start CAD model of system
  • Place final order
Afternoon & Evening
Design:
  • Boards: Combine OLED screen/accelerometer with pulse oximeter board in a new board (maybe upgrade to small TFT as minor)
  • Boards: Speaker board with realtime amplifier and TFT (on the load cell fixed board)
  • Band: Mold design
  • Cases: 3D print mountable cases for the boards
  • Integrate designs into final CAD
  • Document design
  • Finish CAD model of system

Thursday

Fabricate
  • Milling boards
  • Print mold and cast band
  • Print cases
Solder
  • Solder components on milled boards
  • Connect boards with wired (and wireless connection codes)
Finishing
  • Mirror on screen (easy way with the film)
Documentation
  • Document fabrication

Friday

Programming
  • Board level codes
  • Server level codes
Documentation
  • Document codes
Completion
  • Finish anything else

Saturday

Programming & Testing
  • Demo integrated system
  • Test integrated system
Documentation
  • Document testing and evaluation
  • Review and complete documentation (list of questions)
  • Make the video by collaging documentation

Sunday

  • Fill up any gaps
  • Prepare demo on tensegrity table
  • Finalize 1-slide
  • Work on minors
  • If done, work on if there's time

Monday Morning

  • Transport demo on tensegrity table
  • Fill up any gaps
  • Work on minors

Specific Tasks to Complete This Week

Major Tasks
  • CAD model of system
  • Speaker board with realtime amplifier
  • Combine screen/accelerometer with pulse oximeter board in a new board
  • Mold and cast band
  • Design and fabricate casing (print)
  • Schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Serial connection between pulse oximeter and tiny blinking heart for BPM (BPM from IR, SpO2 from delta)
  • Combine multiple boards on the same WiFi (switching tabs is easy way, board hosting the webpage querying and update or Python-based server somewhere where everything posting data, Raspberry Pi)
  • Put+program everything together according to the above (with WiFi for now)
  • Mirror on screen (easy way with the film)
  • Document evaluations and costs (plus the rest of the list here: project presentation requirements)
  • Summary slide and one-minute video for documentation
    • Conception
    • Construction
    • Operation
Minor Tasks
  • Program microphone/speaker
  • Fix reaction time delay code
  • Program LoRa connection
  • Fix OLED plus WiFi issue
  • Upgrade to TFT (SPI is very straightforward, design board with either SPI or OLED connection)
  • Fix heart engraving to center
  • Engrave K9 glass mirror if it arrives
  • RD and IRD isolation slit (maybe wick and then cut)
  • Do the calibration curve for the load cell
  • Finish cardboard laser cutter origami big mirror frame
If There's Time
  • Moving base of mirror
Orders
  • Raspberry Pi Zero (or server host, do some research)
Presentation
  • Aim for 2.5 minutes because Neil will ask questions
  • Generally no slides except for 1 open summary slide (have backup slides in case questions come up!)

Related: See the Development Timeline on the final project page for the overall project schedule.

Day 1: Design Integration

Initial system integration work focused on subsystem validation, CAD model consolidation, and design backbone acquisition for band integration.

Subsystem Validation

Conducted comprehensive testing of all subsystems to ensure proper functionality. Identified and resoldered any defective joints, verifying that each subsystem operates correctly before proceeding with full system integration.

CAD Model Consolidation

Exported CAD models of all PCBs in the final design and imported them into a unified CAD assembly. This consolidated model provides a complete view of the system's mechanical integration and spatial relationships.

Exploded isometric view of the integrated CAD model showing all PCBs, housing components, and wearable band assembly
Integrated CAD Model: Exploded isometric view of the complete system assembly, including all PCBs (pulse oximeter, OLED/accelerometer, speaker/amplifier), main housing with transparent enclosure, and wearable band components. The model shows the spatial relationships between electronic subsystems and mechanical structures, enabling precise integration planning.

Band Design Backbone

Acquired CAD design files for Apple Watch form factor integration, enabling compatibility with existing band designs and standardized watch components. This provides a proven mechanical foundation for the wearable subsystem.

Apple Watch Form Factor: MutantW v2 Project · Instructables Guide
Apple Watch Band Design: Thingiverse Band Files

Next Steps

Resuming the daily schedule tomorrow with parallel work streams prioritized according to the critical path. Tasks that cannot be completed during scheduled days will be shifted to buffer days on Saturday and Sunday to maintain project momentum.

Day 2: Electrical and Mechanical Integration

Physical integration of subsystems into the complete demo table assembly, including mechanical component fabrication and electrical board consolidation.

2.1 Mechanical Integration

Mechanical design integration now includes the complete demo table with precise placement of the MirrorAge handgrip subsystem and the aging clock subsystem. The integrated assembly provides a unified platform for system demonstration and testing.

Complete demo table assembly showing integrated MirrorAge handgrip and aging clock subsystems
Complete Demo Table Assembly: Integrated mechanical design showing precise placement of the MirrorAge handgrip subsystem and aging clock subsystem on the demo table. The assembly demonstrates the spatial relationships and mounting configurations for both subsystems within the unified demonstration platform.

3D Additive Manufacturing

All 3D additive mechanical components were printed for rapid iterative development. The fabrication process required specific print settings and support strategies for different components:

Printing Initiation: 3D printer starting the fabrication process for mechanical components
3D printed casing component during fabrication
Casing Print: Casing component during 3D printing process
Print Configuration Requirements:
  • Casing: Required organic support structures for complex overhangs
  • Dock: Required brim adhesion to prevent warping during printing
  • Bands: Printed using TPU (Thermoplastic Polyurethane) material for flexibility (will spiral into molding and casting in future iterations)
Organic support structure configuration for casing print
Organic Support Configuration: Slicer settings showing organic support structures for the casing component
Brim addition to dock component for improved bed adhesion
Brim Addition: Dock component with brim added to prevent warping during printing
Casing component with organic support structures
Casing with Organic Support: Printed casing component showing organic support structures
TPU bands printed for flexible wearable components
TPU Bands: Flexible wearable band components printed using TPU material
Print Failures and Iteration
Failed casing print showing print quality issues
Failed Casing Print: Initial casing print failure requiring support structure adjustments
Failed dock print showing warping issues
Failed Dock Print: Dock print failure due to warping, resolved with brim addition
Collection of printing failures and debugging process
Printing Failures: Documentation of various print failures encountered during iterative development
Successful printing progress showing completed components
Printing Progress: Successful components showing iterative improvement in print quality

2D Subtractive Manufacturing

The first 2D subtractive mechanical component was debugged and fabricated. The display face component required exporting a DXF of the full face to laser cut an acrylic display that fits the casing precisely. The original display part face was too small because it was filleted, so the edges of the aging clock body were traced and exported for accurate laser cutting.

Laser Cutting Process 1: Initial laser cutting of acrylic display component
Laser Cutting Process 2: Continued laser cutting operation for display face
Acrylic display component fitted into casing
Acrylic Display Fit: Laser-cut acrylic display component precisely fitted into the casing, demonstrating successful integration of 2D subtractive and 3D additive manufacturing components.

2.2 Electrical Integration

Electrical design integration now combines the accelerometer/camera board with the pulse oximeter board into a single unified design that fits inside the casing. The integrated board may be upgraded to include a small TFT screen in a future iteration if space constraints allow.

Board Design Evolution

Initial board design showing size constraints
Initial Board Design: First integrated board design showing size constraints relative to casing dimensions
Board design fitted within casing constraints
Board in Casing: Revised board design fitted within casing dimensional constraints
Final integrated aging clock board design
Final Integrated Board Design: Complete aging clock board design combining accelerometer/camera functionality with pulse oximeter sensors in a single unified PCB layout optimized for casing fit and component placement.

Board Fabrication and Integration

The first version of the aging clock board was milled. The initial board did not fit the casing, requiring either casing adjustment and reprinting, or milling a new miniaturized board with shrunken electronics. Both approaches are being evaluated. Currently designing the MirrorAge board for handgrip and speaker with large TFT screen integration.

Milled integrated aging clock board showing component placement
Milled Integrated Board: First version of the integrated aging clock board after PCB milling, showing component placement and routing
Board nearly fitting in casing showing dimensional constraints
Board Fit Test: Milled board nearly fitting in casing, demonstrating the need for dimensional optimization
Board Deflection Fixing: Process of addressing board deflection and mechanical fit issues during integration testing, demonstrating iterative refinement of the electrical-mechanical interface.

Critical Path Analysis

Project management view of the integration schedule, showing task dependencies, critical milestones, and current progress status.

Critical Path Tasks

Phase 1: Design & Documentation MOSTLY COMPLETE
  • CAD model consolidation and system integration design ✓
  • PCB design: combine OLED/accelerometer with pulse oximeter ✓
  • Demo table integration design with subsystem placement ✓
  • PCB design: speaker board with realtime amplifier and TFT (MirrorAge board)
  • Band mold design
  • 3D printable cases for board mounting ✓
  • System schematic documentation (wired and wireless)
  • Website documentation updates (Day 1 & Day 2) ✓
Phase 2: Fabrication PENDING
  • PCB milling and component soldering
  • Band mold printing and casting
  • 3D printing of board cases
  • Mirror film application to screen
Phase 3: Integration & Programming PENDING
  • Board-level firmware integration
  • WiFi network coordination between boards
  • Server-level code development
  • Serial communication: pulse oximeter to heart display (BPM/SpO2)
  • System wiring and wireless connection setup
Phase 4: Testing & Documentation PENDING
  • Integrated system testing and validation
  • System evaluation and cost documentation
  • One-minute video production (conception, construction, operation)
  • Summary slide preparation
  • Final documentation review and completion

Current Status

Completed:

Subsystem testing and validation, CAD model consolidation, design backbone acquisition for band integration

In Progress:

PCB design consolidation, system schematic documentation, website updates

Upcoming:

PCB fabrication, band molding, firmware integration, system testing, final documentation

Buffer Days (Saturday & Sunday)

Tasks that cannot be completed during scheduled weekdays will be shifted to Saturday and Sunday buffer days. This ensures the critical path remains on schedule while allowing flexibility for unexpected delays or additional refinement work.

Data Integration Methods to Spirally Develop

Progressive development approach for integrating sensor data streams from multiple subsystems, starting with simple serial communication and evolving to wireless network-based architectures.

Method 1: Serial Communication (Easiest)

Direct serial communication through USB cable from computer to microcontroller, using PySerial to stream data. This provides the simplest initial integration path for rapid prototyping and debugging.

Implementation:
  • USB cable connection from computer to ESP32-S3 microcontroller
  • PySerial library for Python-based data streaming
  • Arduino Serial functions for microcontroller-side communication

Method 2: WiFi Client Architecture (Second Easiest)

Configure all microcontrollers as WiFi clients that stream data to a flash web server. This enables wireless communication while maintaining a centralized data aggregation point.

Implementation:
  • All ESP32-S3 boards configured as WiFi clients on the same network
  • Central web server (initially laptop-hosted) receives data streams
  • WiFiClient::write() functions for data transmission

Method 3: MQTT Protocol (Advanced)

Message Queuing Telemetry Transport (MQTT) provides a lightweight, publish-subscribe messaging protocol ideal for IoT device communication. This approach enables decentralized data exchange between all MirrorAge subsystems, allowing each board to publish sensor data and subscribe to relevant topics for coordinated system behavior.

Server Hosting Strategy:

Initial development and testing will use a laptop-hosted MQTT broker. In a later development spiral, the server will be migrated to a dedicated Raspberry Pi Zero or Raspberry Pi 5 for standalone operation and improved system portability. Paho MQTT library has been successfully tested for ESP32-S3 implementation.

Spiral Development Approach

Development will progress through these methods in order of complexity, starting with serial communication for rapid prototyping, then moving to WiFi client architecture for wireless operation, and finally implementing MQTT for advanced decentralized communication. Each subsystem board (pulse oximeter, OLED/accelerometer, speaker/amplifier, load cell) will be integrated progressively, enabling:

  • Incremental complexity management and early validation
  • Decoupled communication between subsystems
  • Real-time data streaming from multiple sensors
  • Scalable architecture for adding new sensor modules
  • Flexible server deployment (laptop → Raspberry Pi migration path)

Reflections & Learnings

Reflections and key learnings from the final project integration week.

Key Points

  • System integration requires careful coordination of mechanical, electrical, and software subsystems
  • Comprehensive planning and day-by-day scheduling are essential for managing complex integration tasks
  • Modular design enables incremental testing and validation of individual components before full system assembly
  • Documentation throughout the integration process supports debugging and future improvements
  • Final integration week demands focus, organization, and the ability to adapt to unexpected challenges

Contributions

Acknowledgments for contributions and collaborations during the final project week.

Ethical AI Use

Documentation of AI-assisted tasks and tools used during the final project integration week.

📋 General Guidelines: See General Commands for Cursor on the homepage for standard guidelines and commands used consistently throughout documentation development.

Cursor · Project Plan & Weekly Schedule

Comprehensive Cursor AI assistance for outlining the project plan and weekly schedule, including documentation structure, content organization, systematic updates across all week pages and the final project page, media integration, and summary generation workflows.

© Saleem A. Al Dajani
Made for HTMAA 2025 • Built with vanilla HTML/CSS



  
  
  Week 14 · Final Project
  
  


  
Saleem A. Al Dajani

Week 14

System Integration

Week Highlights

Final project integration week focused on bringing together all subsystems into a cohesive MirrorAge system, completing documentation, and preparing for final presentation.

Table of Contents

Week 14 System Integration

Final integration week focused on bringing all subsystems together, completing hardware fabrication, firmware integration, and documentation for the MirrorAge system presentation.

Week 14 Day-by-Day System Integration Plan

Positive Possum encouragement meme

Theme of the Week

FINITIATIVE

The act of bringing something to a conclusion or ending in a decisive manner. The ability to efficiently finish tasks and projects with a goal-oriented mindset.

Wednesday

Morning
  • Publish system integration plan on website
  • Update weekly assignment sections on final project page (weeks 10-13)
  • Link final project design files
  • Update reflections and learnings
  • Update picture of prism holder
  • Add final pictures to Slack canvases
  • Create schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Start CAD model of system
  • Place final order
Afternoon & Evening
Design:
  • Boards: Combine OLED screen/accelerometer with pulse oximeter board in a new board (maybe upgrade to small TFT as minor)
  • Boards: Speaker board with realtime amplifier and TFT (on the load cell fixed board)
  • Band: Mold design
  • Cases: 3D print mountable cases for the boards
  • Integrate designs into final CAD
  • Document design
  • Finish CAD model of system

Thursday

Fabricate
  • Milling boards
  • Print mold and cast band
  • Print cases
Solder
  • Solder components on milled boards
  • Connect boards with wired (and wireless connection codes)
Finishing
  • Mirror on screen (easy way with the film)
Documentation
  • Document fabrication

Friday

Programming
  • Board level codes
  • Server level codes
Documentation
  • Document codes
Completion
  • Finish anything else

Saturday

Programming & Testing
  • Demo integrated system
  • Test integrated system
Documentation
  • Document testing and evaluation
  • Review and complete documentation (list of questions)
  • Make the video by collaging documentation

Sunday

  • Fill up any gaps
  • Prepare demo on tensegrity table
  • Finalize 1-slide
  • Work on minors
  • If done, work on if there's time

Monday Morning

  • Transport demo on tensegrity table
  • Fill up any gaps
  • Work on minors

Specific Tasks to Complete This Week

Major Tasks
  • CAD model of system
  • Speaker board with realtime amplifier
  • Combine screen/accelerometer with pulse oximeter board in a new board
  • Mold and cast band
  • Design and fabricate casing (print)
  • Schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Serial connection between pulse oximeter and tiny blinking heart for BPM (BPM from IR, SpO2 from delta)
  • Combine multiple boards on the same WiFi (switching tabs is easy way, board hosting the webpage querying and update or Python-based server somewhere where everything posting data, Raspberry Pi)
  • Put+program everything together according to the above (with WiFi for now)
  • Mirror on screen (easy way with the film)
  • Document evaluations and costs (plus the rest of the list here: project presentation requirements)
  • Summary slide and one-minute video for documentation
    • Conception
    • Construction
    • Operation
Minor Tasks
  • Program microphone/speaker
  • Fix reaction time delay code
  • Program LoRa connection
  • Fix OLED plus WiFi issue
  • Upgrade to TFT (SPI is very straightforward, design board with either SPI or OLED connection)
  • Fix heart engraving to center
  • Engrave K9 glass mirror if it arrives
  • RD and IRD isolation slit (maybe wick and then cut)
  • Do the calibration curve for the load cell
  • Finish cardboard laser cutter origami big mirror frame
If There's Time
  • Moving base of mirror
Orders
  • Raspberry Pi Zero (or server host, do some research)
Presentation
  • Aim for 2.5 minutes because Neil will ask questions
  • Generally no slides except for 1 open summary slide (have backup slides in case questions come up!)

Related: See the Development Timeline on the final project page for the overall project schedule.

Day 1: Design Integration

Initial system integration work focused on subsystem validation, CAD model consolidation, and design backbone acquisition for band integration.

Subsystem Validation

Conducted comprehensive testing of all subsystems to ensure proper functionality. Identified and resoldered any defective joints, verifying that each subsystem operates correctly before proceeding with full system integration.

CAD Model Consolidation

Exported CAD models of all PCBs in the final design and imported them into a unified CAD assembly. This consolidated model provides a complete view of the system's mechanical integration and spatial relationships.

Exploded isometric view of the integrated CAD model showing all PCBs, housing components, and wearable band assembly
Integrated CAD Model: Exploded isometric view of the complete system assembly, including all PCBs (pulse oximeter, OLED/accelerometer, speaker/amplifier), main housing with transparent enclosure, and wearable band components. The model shows the spatial relationships between electronic subsystems and mechanical structures, enabling precise integration planning.

Band Design Backbone

Acquired CAD design files for Apple Watch form factor integration, enabling compatibility with existing band designs and standardized watch components. This provides a proven mechanical foundation for the wearable subsystem.

Apple Watch Form Factor: MutantW v2 Project · Instructables Guide
Apple Watch Band Design: Thingiverse Band Files

Next Steps

Resuming the daily schedule tomorrow with parallel work streams prioritized according to the critical path. Tasks that cannot be completed during scheduled days will be shifted to buffer days on Saturday and Sunday to maintain project momentum.

Day 2: Electrical and Mechanical Integration

Physical integration of subsystems into the complete demo table assembly, including mechanical component fabrication and electrical board consolidation.

2.1 Mechanical Integration

Mechanical design integration now includes the complete demo table with precise placement of the MirrorAge handgrip subsystem and the aging clock subsystem. The integrated assembly provides a unified platform for system demonstration and testing.

Complete demo table assembly showing integrated MirrorAge handgrip and aging clock subsystems
Complete Demo Table Assembly: Integrated mechanical design showing precise placement of the MirrorAge handgrip subsystem and aging clock subsystem on the demo table. The assembly demonstrates the spatial relationships and mounting configurations for both subsystems within the unified demonstration platform.

3D Additive Manufacturing

All 3D additive mechanical components were printed for rapid iterative development. The fabrication process required specific print settings and support strategies for different components:

Printing Initiation: 3D printer starting the fabrication process for mechanical components
3D printed casing component during fabrication
Casing Print: Casing component during 3D printing process
Print Configuration Requirements:
  • Casing: Required organic support structures for complex overhangs
  • Dock: Required brim adhesion to prevent warping during printing
  • Bands: Printed using TPU (Thermoplastic Polyurethane) material for flexibility (will spiral into molding and casting in future iterations)
Organic support structure configuration for casing print
Organic Support Configuration: Slicer settings showing organic support structures for the casing component
Brim addition to dock component for improved bed adhesion
Brim Addition: Dock component with brim added to prevent warping during printing
Casing component with organic support structures
Casing with Organic Support: Printed casing component showing organic support structures
TPU bands printed for flexible wearable components
TPU Bands: Flexible wearable band components printed using TPU material
Print Failures and Iteration
Failed casing print showing print quality issues
Failed Casing Print: Initial casing print failure requiring support structure adjustments
Failed dock print showing warping issues
Failed Dock Print: Dock print failure due to warping, resolved with brim addition
Collection of printing failures and debugging process
Printing Failures: Documentation of various print failures encountered during iterative development
Successful printing progress showing completed components
Printing Progress: Successful components showing iterative improvement in print quality

2D Subtractive Manufacturing

The first 2D subtractive mechanical component was debugged and fabricated. The display face component required exporting a DXF of the full face to laser cut an acrylic display that fits the casing precisely. The original display part face was too small because it was filleted, so the edges of the aging clock body were traced and exported for accurate laser cutting.

Laser Cutting Process 1: Initial laser cutting of acrylic display component
Laser Cutting Process 2: Continued laser cutting operation for display face
Acrylic display component fitted into casing
Acrylic Display Fit: Laser-cut acrylic display component precisely fitted into the casing, demonstrating successful integration of 2D subtractive and 3D additive manufacturing components.

2.2 Electrical Integration

Electrical design integration now combines the accelerometer/camera board with the pulse oximeter board into a single unified design that fits inside the casing. The integrated board may be upgraded to include a small TFT screen in a future iteration if space constraints allow.

Board Design Evolution

Initial board design showing size constraints
Initial Board Design: First integrated board design showing size constraints relative to casing dimensions
Board design fitted within casing constraints
Board in Casing: Revised board design fitted within casing dimensional constraints
Final integrated aging clock board design
Final Integrated Board Design: Complete aging clock board design combining accelerometer/camera functionality with pulse oximeter sensors in a single unified PCB layout optimized for casing fit and component placement.

Board Fabrication and Integration

The first version of the aging clock board was milled. The initial board did not fit the casing, requiring either casing adjustment and reprinting, or milling a new miniaturized board with shrunken electronics. Both approaches are being evaluated. Currently designing the MirrorAge board for handgrip and speaker with large TFT screen integration.

Milled integrated aging clock board showing component placement
Milled Integrated Board: First version of the integrated aging clock board after PCB milling, showing component placement and routing
Board nearly fitting in casing showing dimensional constraints
Board Fit Test: Milled board nearly fitting in casing, demonstrating the need for dimensional optimization
Board Deflection Fixing: Process of addressing board deflection and mechanical fit issues during integration testing, demonstrating iterative refinement of the electrical-mechanical interface.

Critical Path Analysis

Project management view of the integration schedule, showing task dependencies, critical milestones, and current progress status.

Critical Path Tasks

Phase 1: Design & Documentation MOSTLY COMPLETE
  • CAD model consolidation and system integration design ✓
  • PCB design: combine OLED/accelerometer with pulse oximeter ✓
  • Demo table integration design with subsystem placement ✓
  • PCB design: speaker board with realtime amplifier and TFT (MirrorAge board)
  • Band mold design
  • 3D printable cases for board mounting ✓
  • System schematic documentation (wired and wireless)
  • Website documentation updates (Day 1 & Day 2) ✓
Phase 2: Fabrication IN PROGRESS
  • PCB milling: aging clock board milled (fit optimization in progress)
  • PCB milling: MirrorAge board (pending design completion)
  • Component soldering (pending board fit resolution)
  • Band mold printing and casting
  • 3D printing of board cases (casing, dock, bands) ✓
  • 2D subtractive: laser-cut acrylic display ✓
  • Mirror film application to screen
Phase 3: Integration & Programming PENDING
  • Board-level firmware integration
  • WiFi network coordination between boards
  • Server-level code development
  • Serial communication: pulse oximeter to heart display (BPM/SpO2)
  • System wiring and wireless connection setup
Phase 4: Testing & Documentation PENDING
  • Integrated system testing and validation
  • System evaluation and cost documentation
  • One-minute video production (conception, construction, operation)
  • Summary slide preparation
  • Final documentation review and completion

Current Status

Completed:

Subsystem testing and validation, CAD model consolidation, design backbone acquisition for band integration

In Progress:

PCB design consolidation, system schematic documentation, website updates

Upcoming:

PCB fabrication, band molding, firmware integration, system testing, final documentation

Buffer Days (Saturday & Sunday)

Tasks that cannot be completed during scheduled weekdays will be shifted to Saturday and Sunday buffer days. This ensures the critical path remains on schedule while allowing flexibility for unexpected delays or additional refinement work.

Data Integration Methods to Spirally Develop

Progressive development approach for integrating sensor data streams from multiple subsystems, starting with simple serial communication and evolving to wireless network-based architectures.

Method 1: Serial Communication (Easiest)

Direct serial communication through USB cable from computer to microcontroller, using PySerial to stream data. This provides the simplest initial integration path for rapid prototyping and debugging.

Implementation:
  • USB cable connection from computer to ESP32-S3 microcontroller
  • PySerial library for Python-based data streaming
  • Arduino Serial functions for microcontroller-side communication

Method 2: WiFi Client Architecture (Second Easiest)

Configure all microcontrollers as WiFi clients that stream data to a flash web server. This enables wireless communication while maintaining a centralized data aggregation point.

Implementation:
  • All ESP32-S3 boards configured as WiFi clients on the same network
  • Central web server (initially laptop-hosted) receives data streams
  • WiFiClient::write() functions for data transmission

Method 3: MQTT Protocol (Advanced)

Message Queuing Telemetry Transport (MQTT) provides a lightweight, publish-subscribe messaging protocol ideal for IoT device communication. This approach enables decentralized data exchange between all MirrorAge subsystems, allowing each board to publish sensor data and subscribe to relevant topics for coordinated system behavior.

Server Hosting Strategy:

Initial development and testing will use a laptop-hosted MQTT broker. In a later development spiral, the server will be migrated to a dedicated Raspberry Pi Zero or Raspberry Pi 5 for standalone operation and improved system portability. Paho MQTT library has been successfully tested for ESP32-S3 implementation.

Spiral Development Approach

Development will progress through these methods in order of complexity, starting with serial communication for rapid prototyping, then moving to WiFi client architecture for wireless operation, and finally implementing MQTT for advanced decentralized communication. Each subsystem board (pulse oximeter, OLED/accelerometer, speaker/amplifier, load cell) will be integrated progressively, enabling:

  • Incremental complexity management and early validation
  • Decoupled communication between subsystems
  • Real-time data streaming from multiple sensors
  • Scalable architecture for adding new sensor modules
  • Flexible server deployment (laptop → Raspberry Pi migration path)

Reflections & Learnings

Reflections and key learnings from the final project integration week.

Key Points

  • System integration requires careful coordination of mechanical, electrical, and software subsystems
  • Comprehensive planning and day-by-day scheduling are essential for managing complex integration tasks
  • Modular design enables incremental testing and validation of individual components before full system assembly
  • Documentation throughout the integration process supports debugging and future improvements
  • Final integration week demands focus, organization, and the ability to adapt to unexpected challenges

Contributions

Acknowledgments for contributions and collaborations during the final project week.

Ethical AI Use

Documentation of AI-assisted tasks and tools used during the final project integration week.

📋 General Guidelines: See General Commands for Cursor on the homepage for standard guidelines and commands used consistently throughout documentation development.

Cursor · Project Plan & Weekly Schedule

Comprehensive Cursor AI assistance for outlining the project plan and weekly schedule, including documentation structure, content organization, systematic updates across all week pages and the final project page, media integration, and summary generation workflows.

© Saleem A. Al Dajani
Made for HTMAA 2025 • Built with vanilla HTML/CSS



  
  
  Week 14 · Final Project
  
  


  
Saleem A. Al Dajani

Week 14

System Integration

Week Highlights

Final project integration week focused on bringing together all subsystems into a cohesive MirrorAge system, completing documentation, and preparing for final presentation.

Table of Contents

Week 14 System Integration

Final integration week focused on bringing all subsystems together, completing hardware fabrication, firmware integration, and documentation for the MirrorAge system presentation.

Week 14 Day-by-Day System Integration Plan

Positive Possum encouragement meme

Theme of the Week

FINITIATIVE

The act of bringing something to a conclusion or ending in a decisive manner. The ability to efficiently finish tasks and projects with a goal-oriented mindset.

Wednesday

Morning
  • Publish system integration plan on website
  • Update weekly assignment sections on final project page (weeks 10-13)
  • Link final project design files
  • Update reflections and learnings
  • Update picture of prism holder
  • Add final pictures to Slack canvases
  • Create schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Start CAD model of system
  • Place final order
Afternoon & Evening
Design:
  • Boards: Combine OLED screen/accelerometer with pulse oximeter board in a new board (maybe upgrade to small TFT as minor)
  • Boards: Speaker board with realtime amplifier and TFT (on the load cell fixed board)
  • Band: Mold design
  • Cases: 3D print mountable cases for the boards
  • Integrate designs into final CAD
  • Document design
  • Finish CAD model of system

Thursday

Fabricate
  • Milling boards
  • Print mold and cast band
  • Print cases
Solder
  • Solder components on milled boards
  • Connect boards with wired (and wireless connection codes)
Finishing
  • Mirror on screen (easy way with the film)
Documentation
  • Document fabrication

Friday

Programming
  • Board level codes
  • Server level codes
Documentation
  • Document codes
Completion
  • Finish anything else

Saturday

Programming & Testing
  • Demo integrated system
  • Test integrated system
Documentation
  • Document testing and evaluation
  • Review and complete documentation (list of questions)
  • Make the video by collaging documentation

Sunday

  • Fill up any gaps
  • Prepare demo on tensegrity table
  • Finalize 1-slide
  • Work on minors
  • If done, work on if there's time

Monday Morning

  • Transport demo on tensegrity table
  • Fill up any gaps
  • Work on minors

Specific Tasks to Complete This Week

Major Tasks
  • CAD model of system
  • Speaker board with realtime amplifier
  • Combine screen/accelerometer with pulse oximeter board in a new board
  • Mold and cast band
  • Design and fabricate casing (print)
  • Schematic between boards (wired and wireless) — updated system diagram on PPT-like page
  • Serial connection between pulse oximeter and tiny blinking heart for BPM (BPM from IR, SpO2 from delta)
  • Combine multiple boards on the same WiFi (switching tabs is easy way, board hosting the webpage querying and update or Python-based server somewhere where everything posting data, Raspberry Pi)
  • Put+program everything together according to the above (with WiFi for now)
  • Mirror on screen (easy way with the film)
  • Document evaluations and costs (plus the rest of the list here: project presentation requirements)
  • Summary slide and one-minute video for documentation
    • Conception
    • Construction
    • Operation
Minor Tasks
  • Program microphone/speaker
  • Fix reaction time delay code
  • Program LoRa connection
  • Fix OLED plus WiFi issue
  • Upgrade to TFT (SPI is very straightforward, design board with either SPI or OLED connection)
  • Fix heart engraving to center
  • Engrave K9 glass mirror if it arrives
  • RD and IRD isolation slit (maybe wick and then cut)
  • Do the calibration curve for the load cell
  • Finish cardboard laser cutter origami big mirror frame
If There's Time
  • Moving base of mirror
Orders
  • Raspberry Pi Zero (or server host, do some research)
Presentation
  • Aim for 2.5 minutes because Neil will ask questions
  • Generally no slides except for 1 open summary slide (have backup slides in case questions come up!)

Related: See the Development Timeline on the final project page for the overall project schedule.

Day 1: Design Integration

Initial system integration work focused on subsystem validation, CAD model consolidation, and design backbone acquisition for band integration.

Subsystem Validation

Conducted comprehensive testing of all subsystems to ensure proper functionality. Identified and resoldered any defective joints, verifying that each subsystem operates correctly before proceeding with full system integration.

CAD Model Consolidation

Exported CAD models of all PCBs in the final design and imported them into a unified CAD assembly. This consolidated model provides a complete view of the system's mechanical integration and spatial relationships.

Exploded isometric view of the integrated CAD model showing all PCBs, housing components, and wearable band assembly
Integrated CAD Model: Exploded isometric view of the complete system assembly, including all PCBs (pulse oximeter, OLED/accelerometer, speaker/amplifier), main housing with transparent enclosure, and wearable band components. The model shows the spatial relationships between electronic subsystems and mechanical structures, enabling precise integration planning.

Band Design Backbone

Acquired CAD design files for Apple Watch form factor integration, enabling compatibility with existing band designs and standardized watch components. This provides a proven mechanical foundation for the wearable subsystem.

Apple Watch Form Factor: MutantW v2 Project · Instructables Guide
Apple Watch Band Design: Thingiverse Band Files

Next Steps

Resuming the daily schedule tomorrow with parallel work streams prioritized according to the critical path. Tasks that cannot be completed during scheduled days will be shifted to buffer days on Saturday and Sunday to maintain project momentum.

Day 2: Electrical and Mechanical Integration

Physical integration of subsystems into the complete demo table assembly, including mechanical component fabrication and electrical board consolidation.

2.1 Mechanical Integration

Mechanical design integration now includes the complete demo table with precise placement of the MirrorAge handgrip subsystem and the aging clock subsystem. The integrated assembly provides a unified platform for system demonstration and testing.

Complete demo table assembly showing integrated MirrorAge handgrip and aging clock subsystems
Complete Demo Table Assembly: Integrated mechanical design showing precise placement of the MirrorAge handgrip subsystem and aging clock subsystem on the demo table. The assembly demonstrates the spatial relationships and mounting configurations for both subsystems within the unified demonstration platform.

3D Additive Manufacturing

All 3D additive mechanical components were printed for rapid iterative development. The fabrication process required specific print settings and support strategies for different components:

Printing Initiation: 3D printer starting the fabrication process for mechanical components
3D printed casing component during fabrication
Casing Print: Casing component during 3D printing process
Print Configuration Requirements:
  • Casing: Required organic support structures for complex overhangs
  • Dock: Required brim adhesion to prevent warping during printing
  • Bands: Printed using TPU (Thermoplastic Polyurethane) material for flexibility (will spiral into molding and casting in future iterations)
Organic support structure configuration for casing print
Organic Support Configuration: Slicer settings showing organic support structures for the casing component
Brim addition to dock component for improved bed adhesion
Brim Addition: Dock component with brim added to prevent warping during printing
Casing component with organic support structures
Casing with Organic Support: Printed casing component showing organic support structures
TPU bands printed for flexible wearable components
TPU Bands: Flexible wearable band components printed using TPU material
Print Failures and Iteration
Failed casing print showing print quality issues
Failed Casing Print: Initial casing print failure requiring support structure adjustments
Failed dock print showing warping issues
Failed Dock Print: Dock print failure due to warping, resolved with brim addition
Collection of printing failures and debugging process
Printing Failures: Documentation of various print failures encountered during iterative development
Successful printing progress showing completed components
Printing Progress: Successful components showing iterative improvement in print quality

2D Subtractive Manufacturing

The first 2D subtractive mechanical component was debugged and fabricated. The display face component required exporting a DXF of the full face to laser cut an acrylic display that fits the casing precisely. The original display part face was too small because it was filleted, so the edges of the aging clock body were traced and exported for accurate laser cutting.

Laser Cutting Process 1: Initial laser cutting of acrylic display component
Laser Cutting Process 2: Continued laser cutting operation for display face
Acrylic display component fitted into casing
Acrylic Display Fit: Laser-cut acrylic display component precisely fitted into the casing, demonstrating successful integration of 2D subtractive and 3D additive manufacturing components.

2.2 Electrical Integration

Electrical design integration now combines the accelerometer/camera board with the pulse oximeter board into a single unified design that fits inside the casing. The integrated board may be upgraded to include a small TFT screen in a future iteration if space constraints allow.

Board Design Evolution

Initial board design showing size constraints
Initial Board Design: First integrated board design showing size constraints relative to casing dimensions
Board design fitted within casing constraints
Board in Casing: Revised board design fitted within casing dimensional constraints
Final integrated aging clock board design
Final Integrated Board Design: Complete aging clock board design combining accelerometer/camera functionality with pulse oximeter sensors in a single unified PCB layout optimized for casing fit and component placement.

Board Fabrication and Integration

The first version of the aging clock board was milled. The initial board did not fit the casing, requiring either casing adjustment and reprinting, or milling a new miniaturized board with shrunken electronics. Both approaches are being evaluated. Currently designing the MirrorAge board for handgrip and speaker with large TFT screen integration.

Milled integrated aging clock board showing component placement
Milled Integrated Board: First version of the integrated aging clock board after PCB milling, showing component placement and routing
Board nearly fitting in casing showing dimensional constraints
Board Fit Test: Milled board nearly fitting in casing, demonstrating the need for dimensional optimization
Board Deflection Fixing: Process of addressing board deflection and mechanical fit issues during integration testing, demonstrating iterative refinement of the electrical-mechanical interface.

Critical Path Analysis

Project management view of the integration schedule, showing task dependencies, critical milestones, and current progress status.

Critical Path Tasks

Phase 1: Design & Documentation MOSTLY COMPLETE
  • CAD model consolidation and system integration design ✓
  • PCB design: combine OLED/accelerometer with pulse oximeter ✓
  • Demo table integration design with subsystem placement ✓
  • PCB design: speaker board with realtime amplifier and TFT (MirrorAge board)
  • Band mold design
  • 3D printable cases for board mounting ✓
  • System schematic documentation (wired and wireless)
  • Website documentation updates (Day 1 & Day 2) ✓
Phase 2: Fabrication IN PROGRESS
  • PCB milling: aging clock board milled (fit optimization in progress)
  • PCB milling: MirrorAge board (pending design completion)
  • Component soldering (pending board fit resolution)
  • Band mold printing and casting
  • 3D printing of board cases (casing, dock, bands) ✓
  • 2D subtractive: laser-cut acrylic display ✓
  • Mirror film application to screen
Phase 3: Integration & Programming PENDING
  • Board-level firmware integration
  • WiFi network coordination between boards
  • Server-level code development
  • Serial communication: pulse oximeter to heart display (BPM/SpO2)
  • System wiring and wireless connection setup
Phase 4: Testing & Documentation PENDING
  • Integrated system testing and validation
  • System evaluation and cost documentation
  • One-minute video production (conception, construction, operation)
  • Summary slide preparation
  • Final documentation review and completion

Current Status

Completed:

Subsystem testing and validation, CAD model consolidation, demo table integration design, aging clock PCB design (accelerometer/camera + pulse oximeter), 3D printing of mechanical components (casing with organic support, dock with brim, TPU bands), laser-cut acrylic display, initial board milling

In Progress:

Board fit optimization (casing adjustment vs. miniaturized board), MirrorAge board design (handgrip + speaker + TFT), data integration methods documentation (serial, WiFi, MQTT spiral development)

Upcoming:

Component soldering, band mold printing and casting, firmware integration, WiFi/MQTT network setup, system wiring, integrated testing, final documentation

Buffer Days (Saturday & Sunday)

Tasks that cannot be completed during scheduled weekdays will be shifted to Saturday and Sunday buffer days. This ensures the critical path remains on schedule while allowing flexibility for unexpected delays or additional refinement work.

Data Integration Methods to Spirally Develop

Progressive development approach for integrating sensor data streams from multiple subsystems, starting with simple serial communication and evolving to wireless network-based architectures.

Method 1: Serial Communication (Easiest)

Direct serial communication through USB cable from computer to microcontroller, using PySerial to stream data. This provides the simplest initial integration path for rapid prototyping and debugging.

Implementation:
  • USB cable connection from computer to ESP32-S3 microcontroller
  • PySerial library for Python-based data streaming
  • Arduino Serial functions for microcontroller-side communication

Method 2: WiFi Client Architecture (Second Easiest)

Configure all microcontrollers as WiFi clients that stream data to a flash web server. This enables wireless communication while maintaining a centralized data aggregation point.

Implementation:
  • All ESP32-S3 boards configured as WiFi clients on the same network
  • Central web server (initially laptop-hosted) receives data streams
  • WiFiClient::write() functions for data transmission

Method 3: MQTT Protocol (Advanced)

Message Queuing Telemetry Transport (MQTT) provides a lightweight, publish-subscribe messaging protocol ideal for IoT device communication. This approach enables decentralized data exchange between all MirrorAge subsystems, allowing each board to publish sensor data and subscribe to relevant topics for coordinated system behavior.

Server Hosting Strategy:

Initial development and testing will use a laptop-hosted MQTT broker. In a later development spiral, the server will be migrated to a dedicated Raspberry Pi Zero or Raspberry Pi 5 for standalone operation and improved system portability. Paho MQTT library has been successfully tested for ESP32-S3 implementation.

Spiral Development Approach

Development will progress through these methods in order of complexity, starting with serial communication for rapid prototyping, then moving to WiFi client architecture for wireless operation, and finally implementing MQTT for advanced decentralized communication. Each subsystem board (pulse oximeter, OLED/accelerometer, speaker/amplifier, load cell) will be integrated progressively, enabling:

  • Incremental complexity management and early validation
  • Decoupled communication between subsystems
  • Real-time data streaming from multiple sensors
  • Scalable architecture for adding new sensor modules
  • Flexible server deployment (laptop → Raspberry Pi migration path)

Reflections & Learnings

Reflections and key learnings from the final project integration week.

Key Points

  • System integration requires careful coordination of mechanical, electrical, and software subsystems
  • Comprehensive planning and day-by-day scheduling are essential for managing complex integration tasks
  • Modular design enables incremental testing and validation of individual components before full system assembly
  • Documentation throughout the integration process supports debugging and future improvements
  • Final integration week demands focus, organization, and the ability to adapt to unexpected challenges

Contributions

Acknowledgments for contributions and collaborations during the final project week.

Ethical AI Use

Documentation of AI-assisted tasks and tools used during the final project integration week.

📋 General Guidelines: See General Commands for Cursor on the homepage for standard guidelines and commands used consistently throughout documentation development.

Cursor · Project Plan & Weekly Schedule

Comprehensive Cursor AI assistance for outlining the project plan and weekly schedule, including documentation structure, content organization, systematic updates across all week pages and the final project page, media integration, and summary generation workflows.

© Saleem A. Al Dajani
Made for HTMAA 2025 • Built with vanilla HTML/CSS

Updated the Critical Path Analysis to reflect Day 1 and Day 2 progress. Changes:

Updates Made:

1. Phase 1: Design & Documentation — Status changed to "MOSTLY COMPLETE": - Marked completed: CAD model consolidation, aging clock PCB design (OLED/accelerometer + pulse oximeter), demo table integration design, 3D printable cases design, website documentation updates - Remaining: MirrorAge board design, band mold design, system schematic documentation

2. Phase 2: Fabrication — Status changed to "IN PROGRESS": - Completed: 3D printing of board cases (casing, dock, bands), 2D subtractive laser cutting (acrylic display) - In progress: PCB milling (aging clock board milled, fit optimization ongoing) - Pending: Component soldering, band mold printing/casting, MirrorAge board milling

3. Current Status Section — Updated to reflect actual progress: - Completed: Includes all Day 1 and Day 2 accomplishments (CAD, PCB design, 3D printing, laser cutting, initial milling) - In Progress: Board fit optimization, MirrorAge board design, data integration documentation - Upcoming: Soldering, molding, firmware, network setup, testing, documentation

The Critical Path Analysis now reflects the current project status and aligns with the Day 1 and Day 2 integration work.

User Unknown

— run the commits and pushes in small <25mb packets to avoid the limit (make sure to push and sync changes with each small commit because the limit is at the sync in the end). Don’t use ffmpeg everything is already compressed, just one file at a time if they are large

Assistant Unknown

Checking git status and file sizes, then committing and pushing in small batches (<25MB per commit).

Checking file sizes in week14/day2 to identify large files:

Files are under 25MB. Committing in small batches: starting with week14.html, then adding week14/day2 files in groups.

Adding week14/day2 files in small batches, pushing after each commit:

Adding larger files one at a time:

Verifying all files are committed and pushed:

All changes have been committed and pushed in small batches. Summary:

1. week14.html — Updated HTML file (single commit) 2. Design images — Demo table and board design PNGs (4 files) 3. Support/brim images — 3D printing configuration images (2 files) 4. JPEG images — 3D printing progress and board integration images (8 files) 5. Large media files — Added one at a time: - printing-started.mp4 - printing-case.jpeg - failed-case.jpeg - laser-cut-1.mp4 - laser-cut-2.mp4 - board-deflection-fixing.mp4

All files are committed and pushed. The working tree is clean, and all changes are synced with the remote repository. Each commit was under 25MB, and each was pushed immediately to avoid sync limits.

Download Options

For the complete technical details and full conversation transcript: